Multitest
The Multitest MT 9510 XP is a Pick&Place handler designed for tri-temp testing of semiconductor packages. The Multitest MT 9510 XP uses standard Plunge-to-Board contacting and delivers industry-leading temperature accuracy without modifications.[1]

The Multitest MT 9510 XP is a semiconductor test and probe handler.
The MT 9510 XP was evaluated with standard Plunge-to-Board contacting in a temperature-performance comparison.[1]
The MT 9510 XP is used for tri-temperature testing in a manufacturing environment.[1]
The MT 9510 XP was evaluated on a BGA package with a 27 x 27 mm body size.[1]
Documented failure modes, common issues, and field considerations.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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Test and probe systems can handle a broad range of devices including logic ICs, memory chips, analog and mixed-signal circuits, RF components, MEMS sensors, and power devices. The specific test interface and instrumentation are configured according to the device type and test requirements.
A wafer prober contacts devices directly on the wafer using a probe card, allowing electrical tests before dicing. A package handler handles individual packaged devices, placing them into a test socket for final test after packaging. Both automate device handling and sorting but operate at different stages of the manufacturing flow.
Throughput depends on factors such as test time per device, contact and index time (mechanical movements), parallel test capability (number of sites tested simultaneously), and handling speed. System designers optimize these parameters based on the specific device and production volume requirements.
Typical test parameters include DC measurements (leakage current, supply voltage thresholds), AC parameters (timing, rise/fall times), functional logic patterns, analog signal integrity (gain, distortion), and parametric values (resistance, capacitance). The specific tests are defined by the device datasheet and test program.
The following facts about the MT 9510 XP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the MT 9510 XP are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the MT 9510 XP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MT 9510 XP are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the MT 9510 XP are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Last updated Oct 13, 2026.
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