OAI
200
What it is
The OAI 200 is a tabletop mask aligner and UV exposure system.[3][5]
The OAI 200 is used for photolithography tasks that require aligning a photomask to a substrate and then exposing the substrate to ultraviolet light.[3][5]
How it works
The OAI 200 uses an alignment module, an exposure system, light sources, a regulated power-adjustable power supply, a constant intensity controller, shutter and field-illumination control, and alignment optics.[3]
The OAI 200 uses a vacuum chuck for substrate placement and alignment during exposure.[3]
The OAI 200 uses UV exposure systems with power ranging from 200 to 2000 watts and radiation from 220 nm to 436 nm.[3]
Where it fits in the process flow
The OAI 200 can handle pieces of substrates up to six inch diameter wafers or six inch by six inch square substrates.[3]
Applications
The OAI 200 is used for MEMS, nanotechnology, semiconductor bench-top work, microfluidics, thin-film devices, solar cells, display processing, and related UV exposure applications.[4][5]
The OAI 200 can be configured for nanoimprint lithography and for microfluidics applications.[4]
- Lithography
- Alignment
What do the numbers mean?
Vacuum & pumping3
Wafer handling2
Optics & imaging4
Performance1
Dimensions & facilities3
Configuration & options9
What replaced it?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
- [2]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
- [3]manualslib.com — manualslib.commanualslib.com
- [4]oainet.com — oainet.comoainet.com
- [5]oainet.com — oainet.comoainet.com
- [6]Request Equipment Training or Service | Utah Nanofab — nanofab.utah.edunanofab.utah.edu
Last updated Aug 14, 2026.
