AXI S Macro

Inspection systems in semiconductor manufacturing are used to examine wafers or patterned surfaces for visible defects, pattern anomalies, contamination, and other process-related issues. Metrology and inspection tools are typically placed where engineers need fast feedback on process condition and product quality.

Macro inspection tools generally image relatively large areas of a wafer or substrate surface and analyze those images for defects or pattern departures. Macro inspection tools commonly use automated stage motion, optical imaging, and software-based review to detect features that may indicate process excursions.

Metrology and inspection systems are used between unit processes to verify that a wafer remains within process expectations before more value is added downstream. Inspection steps commonly follow patterning, deposition, etch, clean, or other surface-altering operations so that defects can be found before subsequent processing or electrical test.

Macro inspection tools are applied to defect monitoring, yield learning, and process control in wafer fabrication. Macro inspection tools can be used to screen for particles, scratches, stains, resist issues, pattern damage, and other surface-visible conditions that affect downstream manufacturability.