DSS 200 Synergy

Wet processing and clean tools remove particles, residues, and chemical films from wafer surfaces using liquid chemistries, rinsing, and drying steps. Post-CMP scrubbers are used after planarization to reduce residual slurry and contamination before later process steps.

The DSS-200 cleaner uses brush-scrub cleaning and spin plus heat-lamp drying. The DSS-200 platform uses roller PVA brushes. The DSS-200 platform supports downforce control, edge scrub, megasonic options, high-pressure DI water spray, heated DI water feed, and through-the-brush delivery. The Synergy platform uses brush scrub cleaning and spin plus heat lamp drying. The Synergy platform supports NH4OH, dHF, pre-diluted SC-1, citric- or HCL-based SC-2, backside chemical processing, metal CMP cleans, and STI CMP cleans.^[4][5]

The DSS-200 cleaner is used for post-CMP clean, pre-bond clean, pre-photo clean, advanced packaging applications, post-metal deposition, post-ILD deposition, post-scribe, and substrate manufacturing.^[5]

Wet scrub cleaning is applied where particulate removal and low-surface-damage cleaning are important after abrasive or deposition-related steps. Such tools are also used where both wafer faces or the wafer edge can carry contamination that would interfere with later yield-critical processing.