Oxford Instruments

80-etch

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Oxford Instruments80-etch

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What is it?

The source page for the Oxford Plasmalab 80 identifies it as an Oxford Instruments tool with one controller for both RIE and PECVD. It lists PECVD capabilities for amorphous Si, Si3N4, SiONx, and SiO2, and indicates use for wafer or thin film etching/patterning processes including DRIE, ICP RIE, XeF2 dry silicon isotropic etch, O2 plasma, and wet chemical etching.

What can it run?

Process applications and technology nodes documented for this tool.

Wafer or thin film etching/patterning
DRIE
XeF2 dry silicon isotropic etch
O2 plasma
Wet chemical etching
PECVD

What do the numbers mean?

Gas & chemistry1

Source gases available: SiH4, N2, N2O, NH3, Ar^[1]

Control & software1

Controller arrangement: One controller for both RIE and PECVD^[1]

Configuration & options4

OEM: Oxford Instruments^[1]
Model: 80-etch^[1]
S/N: 9M69591A^[1]
PECVD capabilities: Amorphous Si, Si3N4, SiONx, SiO2^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Source gases availableSiH4, N2, N2O, NH3, Ar^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 80-etch are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 80-etch are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 80-etch are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 80-etch are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 80-etch are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 80-etch is not on record.
Answerable by: an OEM datasheet or a fab qualification report