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Oxford Instruments

FlexAL

DepositionOxford Instruments FlexAL family
Research Quality: 50% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

FlexAL — Inventory photo
Fig. 01FlexALInventory photo[1]

What it is

General reference — not yet source-verified

The Oxford Instruments FlexAL is an atomic layer deposition system used for depositing thin films. In the provided facility descriptions, it appears as a deposition tool for thin-film growth in microfabrication settings.

Where it fits in the process flow

General reference — not yet source-verified

The FlexAL sits in the thin-film deposition portion of the process flow, after substrate preparation and before patterning or later integration steps that use the deposited film. It is used to build dielectric and other functional layers on prepared wafers or chips.

What do the numbers mean?

Gas & chemistry1

Gases
BTBAS, TBTDMT, TDMAT, CF4[1]
Accurate?

Configuration & options1

Compatible with TiN, TaN, TiO, TaO, SiN[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • GasesBTBAS, TBTDMT, TDMAT, CF4[1]

Where are the manuals?

Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.

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Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What kind of process does this machine class perform?General reference — not yet source-verified

It performs thin-film deposition, meaning it adds a material layer to a substrate surface in a controlled way.

Where is this class used in manufacturing?General reference — not yet source-verified

It is used in the film-formation stage of the process flow, after the substrate has been prepared and before later integration or finishing steps.

What is the main purpose of a deposition system like this?General reference — not yet source-verified

Its main purpose is to create a film with controlled properties such as coverage, composition, and surface quality.

What kinds of materials are typically applied by this class of tool?General reference — not yet source-verified

This class is used for functional thin films such as insulating, conductive, barrier, protective, or optical coatings.

Not publicly documented

The following facts about the FlexAL are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the FlexAL are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FlexAL are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the FlexAL are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the FlexAL are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the FlexAL are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (7)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Equipment Resources | CNFcnf.cornell.educnf.cornell.edu
  3. [3]ALD/PECVD cluster [OXFORD-cluster] | Quantum-Nano Fabrication and Characterization Facility | University of Waterloouwaterloo.cauwaterloo.ca
  4. [4]Thin films ‒ Center of MicroNanoTechnology CMi ‐ EPFLepfl.chepfl.ch
  5. [5]Vacuum Deposition Recipes - UCSB Nanofab Wikiwiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
  6. [6]Capabilities | UD Nanofabrication Facilityudnf.udel.eduudnf.udel.edu
  7. [7]Brochure_plas_100.pdfnanofab.utah.edunanofab.utah.edu
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Last updated Jul 29, 2026.

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