Oxford Instruments

In semiconductor and microfabrication settings, this class of tool removes material by directing an ion beam at a specimen. It is used for controlled etching and, in some configurations, deposition or process monitoring alongside those functions.
The system uses an ion source to generate an inert argon beam for milling or etching. One installed configuration uses automatic load-lock transfer for single substrates, clamping rings to hold the substrate in the process chamber, and water-cooled holders with backside helium cooling available.[2][3]
Documented failure modes, common issues, and field considerations.
One source states the system as '1994 Oxford Ionfab 300 Plus Ion Beam etching/deposition system.'
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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One configuration uses SIMS endpoint detection.[3]
The following facts about the Ionfab 300 Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the Ionfab 300 Plus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Ionfab 300 Plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Ionfab 300 Plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Ionfab 300 Plus are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the Ionfab 300 Plus are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Last updated Jul 29, 2026.
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