Oxford Instruments
Plasmalab 100
Plate 01Oxford Plasmalab 100 ICP (ID# 3894)
ClassOneEngineeringWatch on YouTubePlate 02Oxford Plasmalab 100 ICP Etcher (ID# 3811)
ClassOneEngineeringWatch on YouTubePlate 03Oxford Plasmalab 100 ICP Etcher (ID# 3811)
ClassOneEngineeringWatch on YouTubePlate 04Video 1 - Oxford Plasmalab 100 ICP System (ID# 3589)
ClassOneEngineeringWatch on YouTube
What it is
General reference — not yet source-verifiedMachines of this class are deposition tools used to place a material layer onto a prepared surface under controlled process conditions. The Plasmalab 100 is an instance of that class, identified here as a deposition system rather than as an etch or metrology tool.
Such systems are used when a process requires a film to be added with controlled composition, thickness, and uniformity. They are part of the general toolset for building functional stacks on wafers or other precision substrates.
How it works
General reference — not yet source-verifiedThe chamber environment, gas delivery, pumping, power input, and substrate conditions are coordinated so that film growth follows the intended chemistry and geometry. Process settings are used to influence film quality, adhesion, conformity, and composition.
Where it fits in the process flow
General reference — not yet source-verifiedDeposition tools sit in the process flow where a new functional layer must be added before later patterning, modification, or packaging steps. They are commonly used early or between process stages whenever a fresh film is needed on the substrate.
Applications
General reference — not yet source-verifiedMachines of this class are used to form insulating, conductive, protective, or functional layers for semiconductor, microfabrication, and precision materials processing. They are also used in related research and development settings where controlled thin-film growth is required.
What do the numbers mean?
Power & electrical4
- RF System:[1]
Vacuum & pumping1
Wafer handling2
Gas & chemistry6
- Gas Box:[1]
Control & software1
Configuration & options6
- Chamber:[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| System 100 PECVD / FlexAL ALD (thermal/plasma) cluster system | — | — | Described as a cluster comprised of a FlexAL ALD system and a PlasmaLab 100 PECVD system sharing a common loadlock. | uwaterloo.ca[6] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Dry pumpEdwards QDP 40[1]
- Voltage208 VAC, 3 Phase[1]
- ConfigurationGas Box:[1]
- Gas 1MKS 1479 A, 5% SiH4 / N2, 1000 SCCM[1]
- Gas 2MKS 1479 A, NH3, 100 SCCM[1]
- Gas 3MKS 1179 A, N2, 2000 SCCM[1]
- Gas 4MKS 1179 A, N2O, 3000 SCCM[1]
- Gas 5MKS 1179 A, ,O2, 300 SCCM[1]
- ConfigurationRF System:[1]
- RF GeneratorAE RFX 600 A[1]
- LF GeneratorAE LF-5[1]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- Oxford-PECVD-SOP_REV-F.pdfSOPasu.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of tool is the Plasmalab 100?General reference — not yet source-verified
It is a deposition system, meaning it belongs to the class of equipment used to create thin films on substrates.
What does a deposition system do in general?General reference — not yet source-verified
It adds a material layer to a surface under controlled conditions so that the resulting film has the intended composition and properties.
Where is this class used in a process flow?General reference — not yet source-verified
It is used whenever a new layer must be formed before later patterning, treatment, or assembly steps.
What kinds of films are made with this class of tool?General reference — not yet source-verified
Such systems are used for a range of functional films, including insulating, conductive, protective, and other engineered layers.
Not publicly documented
The following facts about the Plasmalab 100 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 100 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Plasmalab 100 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab 100 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab 100 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Plasmalab 100 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (10)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]uwaterloo.ca — uwaterloo.cauwaterloo.ca
- [7]Oxford 100 ICP Dielectric Etcher | CNF Users — cnfusers.cornell.educnfusers.cornell.edu
- [8]Cleanroom Equipment Capabilities and Materials Exclusions | Utah Nanofab — nanofab.utah.edunanofab.utah.edu
- [9]Etching Systems — nanolab.berkeley.edunanolab.berkeley.edu
- [10]Oxford-PECVD-SOP_REV-F.pdf — cores.research.asu.educores.research.asu.edu
Last updated Jul 30, 2026.
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