Tool family
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| System 100 PECVD / FlexAL ALD (thermal/plasma) cluster system | — | — | Described as a cluster comprised of a FlexAL ALD system and a PlasmaLab 100 PECVD system sharing a common loadlock. | uwaterloo.ca[1] |
The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.
The Oxford Plasmalab 100 ICP-RIE is an inductively coupled plasma reactive ion etch system.
Oxford Instruments Plasmalab 100 Plus RIE is a reactive ion etcher with a load-locked system and a gas module set up for Ar, O2, Cl2, and SiCl4.
The Oxford Plasmalab 100 RIE is a reactive ion etching platform for dielectric etching, MEMS, and R&D applications.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Plasmalab 100 Plus | — | — | Allows small batch processing for R&D and Pilot Production; supports up to 8''/200 mm wafers; load-locked system | classoneequipment.com[2] |
| Plasmalab 100 RIE (FL) | — | — | Configured for SiO2 plasma etching; supports wafer sizes up to 300 mm; 330 mm platen; water-cooled electrode; Advanced Energy RFX 600A RF generator; Alcatel turbo pump; blue PLC control | semistarcorp.com[3] |
The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.
The Oxford Plasmalab 100 ICP-RIE is an inductively coupled plasma reactive ion etch system.
Oxford Instruments Plasmalab 100 Plus RIE is a reactive ion etcher with a load-locked system and a gas module set up for Ar, O2, Cl2, and SiCl4.
The Oxford Plasmalab 100 RIE is a reactive ion etching platform for dielectric etching, MEMS, and R&D applications.