Oxford Instruments
Plasmalab 100 ICP 180
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What is it?
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does an etch system of this class do?General reference — not yet source-verified
It removes material from selected areas of a substrate by using a plasma-based dry process, allowing patterned structures to be transferred from a mask into the underlying layer.
Why use plasma etching instead of wet chemical removal?General reference — not yet source-verified
Plasma etching is used when directional removal, tighter profile control, or better feature definition is needed. It is especially useful when the process must follow a patterned mask closely.
What kinds of materials are processed on this class of tool?General reference — not yet source-verified
Such systems are used on a range of thin films and substrate materials common in semiconductor and precision microfabrication work, with process chemistry chosen to match the material being removed.
Where does this machine fit in fabrication?General reference — not yet source-verified
It is a pattern transfer tool used during the sequence of steps that turn a designed mask pattern into a physical structure on the substrate.
What process variables matter in this class of equipment?General reference — not yet source-verified
Important variables include the gas mixture, plasma conditions, chamber environment, and etch time, since these determine material removal behavior and feature shape.
Not publicly documented
The following facts about the Plasmalab 100 ICP 180 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 100 ICP 180 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab 100 ICP 180 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab 100 ICP 180 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab 100 ICP 180 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab 100 ICP 180 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
Last updated Jul 29, 2026.