Oxford Instruments
Plasmalab 100 ICP 180
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Oxford Instruments Plasmalab 100 ICP 180 is an etch system. The Oxford Instruments Plasmalab 100 ICP 180 uses 3 Phase power. The Oxford Instruments Plasmalab 100 ICP 180 is specified at 208 Vac and 50/60 Hz.[1][2]
What it is
General reference — not yet source-verifiedThe Oxford Instruments Plasmalab 100 ICP 180 is an inductively coupled plasma (ICP) etcher designed for dry etching processes in semiconductor and microfabrication applications.
How it works
General reference — not yet source-verifiedInductively coupled plasma etchers generate a high-density plasma using a radio-frequency coil wrapped around the chamber. The plasma source allows independent control of ion density (via coil power) and ion energy (via substrate bias), enabling anisotropic etching with good profile control.
Process gases are introduced into the chamber and dissociated into reactive species that chemically attack the substrate material. Byproducts are removed by the vacuum system.
Where it fits in the process flow
General reference — not yet source-verifiedSuch etchers are employed in front-end-of-line (FEOL) and back-end-of-line (BEOL) steps for etching dielectrics, semiconductors, and metals. Upstream steps include photoresist coating and exposure; downstream steps include resist stripping and cleaning.
Applications
General reference — not yet source-verifiedThe ICP technology provides high etch rates and low damage, making it appropriate for processes requiring depth control and sidewall passivation.
What do the numbers mean?
Power & electrical5
- 50/60 Hz[1]
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Plasmalab 100 ICP 180 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 100 ICP 180 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab 100 ICP 180 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab 100 ICP 180 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab 100 ICP 180 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab 100 ICP 180 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]Inventory photo
- [4]Inventory photo
Last updated Oct 12, 2026.
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