Oxford Instruments

Plate 01Oxford Plasmalab System 100 RIE ,Reactive Ion Etch System semiconductor equipment
Plate 02Oxford Plasmalab System 100 Reactive Ion Etch (RIE) #56082
The Oxford Instruments Plasmalab 100 is a reactive ion etcher (RIE). The Oxford Instruments Plasmalab 100 is manufactured by Oxford Instruments Plasma Technology.[1][4][6][5]
The system is configured for semiconductor plasma etching applications including research and development, pilot production, and MEMS fabrication.[4][5]
The Plasmalab 100 RIE employs a 13.56 MHz RF generator with up to 600 W of power. The system has a water-cooled electrode that maintains a temperature range of 10°C to 80°C. The chamber is evacuated by a turbo pump backed by a dry mechanical pump.[5]
The Plasmalab 100 RIE is configured as a load-locked system suitable for small batch processing in R&D and pilot production environments.[4]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Plasmalab 100 Plus | — | — | Allows small batch processing for R&D and Pilot Production; supports up to 8''/200 mm wafers; load-locked system | classoneequipment.com[4] |
| Plasmalab 100 RIE (FL) | — | — | Configured for SiO2 plasma etching; supports wafer sizes up to 300 mm; 330 mm platen; water-cooled electrode; Advanced Energy RFX 600A RF generator; Alcatel turbo pump; blue PLC control | semistarcorp.com[5] |
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The following facts about the Plasmalab 100 RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 100 RIE are on record.
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The process node or technology generation of the Plasmalab 100 RIE is not on record.
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Last updated Aug 14, 2026.