Oxford Instruments
Plasmalab 800 Plus RIE
The Oxford Instruments Plasmalab 800 Plus RIE is a reactive ion etching system. The Oxford Instruments Plasmalab 800 Plus RIE uses a PC controller providing an intuitive user interface. The Oxford Instruments Plasmalab 800 Plus RIE keeps its footprint minimal by locating all electronics and vacuum components within the tool body.[1][2]
Power
Advanced Energy RFX 600A RF supply[3]
Vacuum
Leybold TMP-361C turbopump[3]
Gas delivery
Four MFC gas controllers[2]
What it is
General reference — not yet source-verifiedReactive ion etchers are dry plasma process tools used to remove material from wafer surfaces with directional ion-assisted chemistry. Reactive ion etchers are used in microfabrication flows after pattern definition so that a resist or hard-mask image can be transferred into an underlying film.
How it works
General reference — not yet source-verifiedReactive ion etchers operate by sustaining a low-pressure plasma from process gases inside a vacuum chamber while RF power drives ion bombardment toward the substrate. Reactive ion etchers combine chemical reaction from plasma species with physical ion impact so that patterned films can be etched with controlled profile shape.
Where it fits in the process flow
General reference — not yet source-verifiedReactive ion etchers are pattern transfer tools that sit after lithographic masking and before later strip, clean, deposition, or integration steps. Reactive ion etchers are used when a process needs anisotropic dry etching rather than liquid wet etching.
Applications
General reference — not yet source-verifiedReactive ion etchers are used to etch thin films and surface layers in semiconductor and related microfabrication work. Reactive ion etchers support transfer of patterned features into dielectrics, semiconductors, metals, and hard masks when a plasma process is selected for directional material removal.
What do the numbers mean?
Power & electrical1
- Advanced Energy RFX 600A RF supply[3]
Vacuum & pumping5
Gas & chemistry3
Control & software3
Configuration & options9
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationAdvanced Energy RFX 600A RF supply[3]
- ConfigurationLeybold Harris Turbotronik NT20 turbopump controller[3]
- ConfigurationLeybold TMP-361C turbopump[3]
- ConfigurationBusch Cobra BA100 vacuum pump[3]
- Footprint designAll electronics and vacuum components located within the tool body to minimize footprint[2]
- MFC gas controllersFour MFC gas controllers[2]
- GasesO2, CF4, Ar, CHF3[2]
- Top electrode gas deliveryShower head gas delivery[2]
- Vacuum systemTurbo pump and dry pump[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of tool is the Oxford Instruments Plasmalab 800 Plus RIE?
The Oxford Instruments Plasmalab 800 Plus RIE is a reactive ion etching system.[3][1][2]
Not publicly documented
The following facts about the Plasmalab 800 Plus RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 800 Plus RIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab 800 Plus RIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab 800 Plus RIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab 800 Plus RIE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab 800 Plus RIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
- [2]semistarcorp.com — semistarcorp.comsemistarcorp.com
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
Last updated Oct 17, 2026.
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