Oxford Instruments
Plate 01Oxford Instruments Plasmalab 80+ DPCVD semiconductor equipment
Plate 02Oxford PlasmaLab 80 Plus RIE PECVD Semiconductor equipment ~8 inch
Plate 03Plasmalab 80 Plus RIE
Plate 04Oxford Plasmalab 80 Plus PECVD System (ID# 3908)
Wafer size
up to 8-inch diameter wafers
Power
300 W RF and 300 W ICP[1]
Vacuum
Bosch (gas chopping) or cryo processes[1]
Process applications and technology nodes documented for this tool.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the Plasmalab80 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab80 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab80 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab80 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab80 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab80 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 29, 2026.
The Tegal 1511e is a tri-electrode dual-frequency plasma etch system for processing three- to six-inch wafers.
General referenceLam Research 2300 is an etch system used for pattern transfer in semiconductor processing. It belongs to the class of plasma-based etch equipment used to remove selected material from a wafer according to a patterned mask.