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Oxford Instruments

PlasmaPro 100 Cobra ICP-RIE

EtchOxford Instruments PlasmaPro 100 family
Research Quality: 30% complete
PlasmaPro 100 Cobra ICP-RIE — Inventory photo
Fig. 01PlasmaPro 100 Cobra ICP-RIEInventory photo[1]

Power

208 V, 3 Phase, 50/60 Hz[1]

Vacuum

Pfeiffer Adixen A 124 H Vacuum Pump[1]

Gas delivery

Gas Box[1]

What is it?

Oxford Instruments PlasmaPro 100 Cobra ICP-RIE is an inductively coupled plasma reactive ion etch system with process capability for wafer sizes up to 200mm.

What do the numbers mean?

Power & electrical2

Voltage
208 V, 3 Phase, 50/60 Hz[1]
Accurate?
Advanced Energy paramount MF 5003 RF Generator[1]
Accurate?

Vacuum & pumping3

Pfeiffer Adixen Magpower Turbopump Controller[1]
Accurate?
Pfeiffer Adixen A 124 H Vacuum Pump[1]
Accurate?
Pfeiffer Adixen ZCP 15 G Vacuum Pump[1]
Accurate?

Wafer handling1

Configured for 6" substrates[1]
Accurate?

Gas & chemistry1

Gas Box[1]
Accurate?

Control & software1

Control Computer & LCD Monitor[1]
Accurate?

Configuration & options2

Includes:[1]
Accurate?
OS PTIQ Version 2021.12.2.0[1]
Accurate?
Interested in this tool?
Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Voltage208 V, 3 Phase, 50/60 Hz[1]
  • ConfigurationAdvanced Energy paramount MF 5003 RF Generator[1]
  • ConfigurationPfeiffer Adixen Magpower Turbopump Controller[1]
  • ConfigurationPfeiffer Adixen A 124 H Vacuum Pump[1]
  • ConfigurationPfeiffer Adixen ZCP 15 G Vacuum Pump[1]
  • ConfigurationGas Box[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the PlasmaPro 100 Cobra ICP-RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PlasmaPro 100 Cobra ICP-RIE are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the PlasmaPro 100 Cobra ICP-RIE are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the PlasmaPro 100 Cobra ICP-RIE are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the PlasmaPro 100 Cobra ICP-RIE are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the PlasmaPro 100 Cobra ICP-RIE is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]PlasmaPro 100 Cobra ICP-RIE – Nano Vacuum Pty Ltdnanovactech.comnanovactech.com
  3. [3]Learn all about the 'PlasmaPro 100 Cobra ICP-RIE', by Oxford Instruments! The PlasmaPro 100 Cobra ICP RIE system utilises a high-density inductively coupled plasma to achieve fast etch rates. The process modules offer excellent uniformity, high-throughput, high-precision and low-damage processes for wafer sizes up to 200mm, supporting a number of markets including, GaAs & InP laser optoelectronics, SiC & GaN power electronics/RF and MEMS & sensors. More Here: https://bit.ly/3Rxi9F0 #plasma #2Dmaterials #photonics #spintronics #quantumcomputing #nanofabrication #nanovacuum #OxfordInstruments | Nano Vacuumfacebook.comfacebook.com
  4. [4]Equipment Capabilities - Electrical & Computer Engineeringece.utoronto.caece.utoronto.ca
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Last updated Jul 29, 2026.

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