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Oxford Instruments

PlasmaPro 100 Cobra ICP-RIE

EtchOxford Instruments PlasmaPro 100 family
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The PlasmaPro 100 Cobra ICP-RIE is an Oxford Instruments inductively coupled plasma reactive ion etch system. The PlasmaPro 100 Cobra ICP-RIE is configured for 6" substrates. The PlasmaPro 100 Cobra ICP-RIE supports wafer sizes up to 200mm.[1][2][3]

PlasmaPro 100 Cobra ICP-RIE — Inventory photo
Fig. 01PlasmaPro 100 Cobra ICP-RIEInventory photo[1]

Power

208 V, 3 Phase, 50/60 Hz[1]

Vacuum

Pfeiffer Adixen A 124 H Vacuum Pump[1]

Performance

fast etch rates[3]

Gas delivery

Gas Box[1]

How it works

The PlasmaPro 100 Cobra ICP-RIE system uses a high-density inductively coupled plasma to achieve fast etch rates. The process modules support wafer sizes up to 200 mm.[3]

What do the numbers mean?

Power & electrical5

Voltage
208 V, 3 Phase, 50/60 Hz[1]
Accurate?
Advanced Energy paramount MF 5003 RF Generator[1]
Accurate?
Electrical requirements
208 V, 3 phase, 50/60 Hz[1]
Accurate?
Included components (example configuration)
Advanced Energy paramount MF 5003 RF Generator; Pfeiffer Adixen Magpower Turbopump Controller; Pfeiffer Adixen A 124 H Vacuum Pump; Pfeiffer Adixen ZCP 15 G Vacuum Pump; Gas Box; Control Computer & LCD Monitor with OS PTIQ Version 2021.12.2.0[1]
Accurate?
Upgrades/accessories available
Dry pump N2 standby, gas pod, Logviewer software, optical end point detectors, soft pump, turbomolecular vacuum pump, X20 Control System, Advanced Energy Paramount generator, automatic pressure control, dual CM gauge switching, LN2 autochangeover, TEOS liquid level sensing[2]
Accurate?

Vacuum & pumping3

Pfeiffer Adixen Magpower Turbopump Controller[1]
Accurate?
Pfeiffer Adixen A 124 H Vacuum Pump[1]
Accurate?
Pfeiffer Adixen ZCP 15 G Vacuum Pump[1]
Accurate?

Wafer handling9

Configured for 6" substrates[1]
Accurate?
Wafer size support (200 mm platform)
200 mm (8 in) platform; compatible with all wafer sizes up to 200 mm[2]
Accurate?
Wafer size (configured system)
6 inch substrates[1]
Accurate?
Substrate temperature range
-150°C to +400°C[2]
Accurate?
Configured substrate size
6" substrates[1]
Accurate?
Wafer size platform
200mm platform[2]
Accurate?
Maximum wafer size
up to 200mm[2]
Accurate?
Wafer size capability
up to 200mm[2]
Accurate?
Wafer size capability
up to 200mm wafers[3]
Accurate?

Gas & chemistry2

Gas Box[1]
Accurate?
Etch chemistries
SF6, CHF3, CF4, O2[4]
Accurate?

Performance3

Etch performance
fast etch rates[3]
Accurate?
Process characteristics
excellent uniformity, high-throughput, high-precision and low-damage processes[3]
Accurate?
Performance characteristics
excellent uniformity, high-throughput, high-precision, and low-damage processes[3]
Accurate?

Control & software1

Control Computer & LCD Monitor[1]
Accurate?

Configuration & options9

Includes:[1]
Accurate?
OS PTIQ Version 2021.12.2.0[1]
Accurate?
ICP source sizes
65 mm, 180 mm, 300 mm[2]
Accurate?
OEM
Oxford Instruments[1]
Accurate?
Model
PlasmaPro 100 Cobra ICP-RIE[1]
Accurate?
Process type
Inductively Coupled Plasma - Reactive Ion Etch[1]
Accurate?
Plasma source
high-density inductively coupled plasma[3]
Accurate?
Etch process
ICP reactive ion etching on silicon based materials[4]
Accurate?
Materials
SiO2, Si3N4, and isotropic Si etching[4]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Voltage208 V, 3 Phase, 50/60 Hz[1]
  • ConfigurationAdvanced Energy paramount MF 5003 RF Generator[1]
  • ConfigurationPfeiffer Adixen Magpower Turbopump Controller[1]
  • ConfigurationPfeiffer Adixen A 124 H Vacuum Pump[1]
  • ConfigurationPfeiffer Adixen ZCP 15 G Vacuum Pump[1]
  • ConfigurationGas Box[1]
  • Etch chemistriesSF6, CHF3, CF4, O2[4]
  • Electrical requirements208 V, 3 phase, 50/60 Hz[1]
  • Included components (example configuration)Advanced Energy paramount MF 5003 RF Generator; Pfeiffer Adixen Magpower Turbopump Controller; Pfeiffer Adixen A 124 H Vacuum Pump; Pfeiffer Adixen ZCP 15 G Vacuum Pump; Gas Box; Control Computer & LCD Monitor with OS PTIQ Version 2021.12.2.0[1]
  • Upgrades/accessories availableDry pump N2 standby, gas pod, Logviewer software, optical end point detectors, soft pump, turbomolecular vacuum pump, X20 Control System, Advanced Energy Paramount generator, automatic pressure control, dual CM gauge switching, LN2 autochangeover, TEOS liquid level sensing[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the PlasmaPro 100 Cobra ICP-RIE?

The PlasmaPro 100 Cobra ICP-RIE is an inductively coupled plasma reactive ion etch system.[1]

How large a wafer can the PlasmaPro 100 Cobra ICP-RIE process modules support?

The PlasmaPro 100 Cobra ICP-RIE process modules support wafer sizes up to 200 mm.[3]

Not publicly documented

The following facts about the PlasmaPro 100 Cobra ICP-RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PlasmaPro 100 Cobra ICP-RIE are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the PlasmaPro 100 Cobra ICP-RIE are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the PlasmaPro 100 Cobra ICP-RIE are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the PlasmaPro 100 Cobra ICP-RIE are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the PlasmaPro 100 Cobra ICP-RIE is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]nanovactech.com — nanovactech.comnanovactech.com
  3. [3]facebook.com — facebook.comfacebook.com
  4. [4]ece.utoronto.ca — ece.utoronto.caece.utoronto.ca
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Last updated Oct 17, 2026.

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