Plasma-Therm

RIE790

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Plasma-ThermRIE790

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What is it?

The NanoFab lists the PlasmaTherm RIE790 among its dry etch tools. It is described as a reactive ion etch (RIE) system with a parallel plate reactor, and it is associated with fluorine-based chemistries. The source lists it as suitable for semiconductors, dielectrics, and metals.

What can it run?

Process applications and technology nodes documented for this tool.

Dry etching

What do the numbers mean?

Gas & chemistry1

Chemistries: SF6, CHF3, CF4, O2, Ar^[1]

Configuration & options6

Manufacturer: PlasmaTherm^[1]
Model: RIE790^[1]
Process type: Reactive ion etch (RIE)^[1]
Reactor type: Parallel plate^[1]
Etch targets: Semiconductors, dielectrics, metals^[1]
Restriction: None^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

ChemistriesSF6, CHF3, CF4, O2, Ar^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the RIE790 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the RIE790 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the RIE790 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the RIE790 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the RIE790 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the RIE790 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources

[1]cores.research.asu.edu — cores.research.asu.educores.research.asu.edu
[2]Dry etch | NanoFab | Core Facilities | ASU — cores.research.asu.educores.research.asu.edu