SCREEN
WD 620 C
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
SCREEN WD 620 C is a wet bench. SCREEN WD 620 C is used for Si and SiC base wafer. SCREEN WD 620 C is categorized for wet processing and clean.[1][2]
What it is
How it works
General reference — not yet source-verifiedA wet bench typically consists of a series of chemical baths arranged linearly or in a cluster. Wafers are carried in a basket that is moved from bath to bath manually or by a robotic transport system. The process parameters such as immersion time, chemical temperature, and agitation are controlled by a programmable logic controller.
After chemical treatment, wafers are rinsed with deionized water to remove residual chemicals and then dried using spin drying or a nitrogen blow-off station integrated into the bench.
Where it fits in the process flow
General reference — not yet source-verifiedFor silicon carbide wafers, wet processing steps are critical to remove subsurface damage and to prepare the surface for epitaxial growth or metal contact formation.
Applications
General reference — not yet source-verifiedSilicon carbide wafers are used in applications such as power semiconductor devices, LEDs, and RF components. Wet processing of these wafers includes cleaning, etching, and surface activation. The wet bench is also suitable for silicon wafer processing in standard integrated circuit manufacturing.
What do the numbers mean?
Wafer handling2
Configuration & options6
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the WD 620 C are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the WD 620 C are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the WD 620 C are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the WD 620 C are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the WD 620 C are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the WD 620 C is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 17, 2026.
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