SCREEN
The SCREEN ZI 2000 is a wafer pattern inspection system. The SCREEN ZI 2000 supports wafer sizes from φ76 mm to φ200 mm. The SCREEN ZI 2000 uses comparative inspection methods including Die to Die and Cell to Cell.[1]

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The ZI 2000 uses comparative inspection, including Die to Die and Cell to Cell methods.[1][3]
The ZI 2000 inspects wafers from 76 mm to 200 mm in diameter.[1][3]
The following facts about the ZI 2000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ZI 2000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ZI 2000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ZI 2000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ZI 2000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ZI 2000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 13, 2026.
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