Signatone
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The Signatone S 1160 MW D 6 is a probe station for 6-inch wafers. The Signatone S 1160 MW D 6 is equipped with 2x, 10x, and 20x eyepieces.[1][2]
Probe stations combine a sample stage, a viewing system, and movable probe manipulators so an operator can position probes onto target features. Probe stations are used with external measurement instruments that source signals and read electrical response from the contacted device structures.
Probe stations sit in electrical characterization and analytical test flows rather than in production patterning, deposition, or etch steps. Probe stations are used after wafers or test structures exist and before package level evaluation when direct wafer or die contact is needed.
Probe stations are used for wafer level device testing, parametric measurements, process monitoring, and engineering evaluation of semiconductor structures. Probe stations are also used in laboratory work on dies, substrates, and other microelectronic samples that require precise electrical contact under visual observation.
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The following facts about the S 1160 MW D 6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the S 1160 MW D 6 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the S 1160 MW D 6 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the S 1160 MW D 6 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the S 1160 MW D 6 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the S 1160 MW D 6 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 15, 2026.
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