Waferpedia

SPTS

XeF2

EtchUp to 6-inch wafersSPTS XeF2 family
Research Quality: 40% complete
XeF2 — aggiefab.tamu.edu
Fig. 01XeF2aggiefab.tamu.edu[2]
  • Plate 01XeF2 Pulsing Etcher - How to prepare the sample

    InrfucirvineWatch on YouTube
  • Plate 02XeF2 Pulsing Etcher - Standard Operating Procedures

    InrfucirvineWatch on YouTube
  • Plate 03Enhanced, Site-Specific Si Etch with XeF2 Gas and FIB

    The Kavli Nanoscience Institute at CaltechWatch on YouTube

Wafer size

Up to 6-inch wafers

Gas delivery

Continuous and pulsed gas flow[2]

What is it?

The sources describe the SPTS XeF2 as a dry vapor etching system used for MEMS release and sacrificial-layer etching. It is stated to support continuous and pulsed gas flow, to operate at room temperature with no plasma, and to process substrates up to 6-inch wafers.

What can it run?

Process applications and technology nodes documented for this tool.

  • Etching sacrificial layers in MEMS devices
  • Releasing MEMS moving components

What do the numbers mean?

Wafer handling1

Substrate size
Up to 6-inch wafers[2]
Accurate?

Gas & chemistry2

Selectivity
Over 1000:1 between Si/photoresist, Si/SiO2, and Si/SiN[2]
Accurate?
Gas flow modes
Continuous and pulsed gas flow[2]
Accurate?

Configuration & options4

Etch type
Isotropic etch[2]
Accurate?
Operating temperature
Room temperature[2]
Accurate?
Plasma
No plasma[2]
Accurate?
Isotropic etch materials
Si, Mo, Ge, W, C[2]
Accurate?

Vintage & configurations

  1. 2013Acquisition of XACTIX, Inc.[1]

    SPTS acquired XACTIX, Inc. in June 2013.

  2. 2013XACTIX acquisition[1]

    SPTS acquired XACTIX, Inc. in June 2013.

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • SelectivityOver 1000:1 between Si/photoresist, Si/SiO2, and Si/SiN[2]
  • Gas flow modesContinuous and pulsed gas flow[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the XeF2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented variants, configuration options, or revision breakpoints of the XeF2 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the XeF2 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the XeF2 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the XeF2 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the XeF2 are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.orgweb.archive.org
  2. [2]aggiefab.tamu.eduaggiefab.tamu.eduaggiefab.tamu.edu
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Last updated Jul 29, 2026.

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