SPTS
XeF2
The SPTS XeF2 is a highly selective isotropic etching system. The SPTS XeF2 operates at room temperature with no plasma. The SPTS XeF2 processes substrates up to 6-inch wafers.[1][2]
Plate 01XeF2 Pulsing Etcher - How to prepare the sample
InrfucirvineWatch on YouTubePlate 02XeF2 Pulsing Etcher - Standard Operating Procedures
InrfucirvineWatch on YouTubePlate 03Enhanced, Site-Specific Si Etch with XeF2 Gas and FIB
The Kavli Nanoscience Institute at CaltechWatch on YouTube
Wafer size
Up to 6-inch wafers
Gas delivery
Continuous and pulsed gas flow[1]
What it is
General reference — not yet source-verifiedThe SPTS XeF2 is a gas-phase isotropic etch system used for semiconductor and microelectromechanical fabrication.
How it works
Where it fits in the process flow
Applications
The SPTS XeF2 is used for MEMS sacrificial-layer removal and device release. The SPTS XeF2 can support release of structures where high selectivity to silicon dioxide, silicon nitride, and photoresist is important.[1][3]
- Etching sacrificial layers in MEMS devices
- Releasing MEMS moving components
What do the numbers mean?
Wafer handling1
Gas & chemistry3
Configuration & options4
Vintage & configurations
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the XeF2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the XeF2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the XeF2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the XeF2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the XeF2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the XeF2 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]aggiefab.tamu.edu — aggiefab.tamu.eduaggiefab.tamu.edu
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]web.archive.org — web.archive.orgweb.archive.org
- [4]XeF2 Vapor Etch | VINSE | Vanderbilt University — vanderbilt.eduvanderbilt.edu
Last updated Oct 11, 2026.
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