Waferpedia

STS

Multiplex ASE ICP Deep Silicon

EtchManual wafer lockSTS Multiplex family
Research Quality: 30% complete
Multiplex ASE ICP Deep Silicon — Inventory photo
Fig. 01Multiplex ASE ICP Deep SiliconInventory photo[1]

Wafer size

Manual wafer lock

Vacuum

Pumps are not included[1]

What is it?

The STS Multiplex ASE ICP Deep Silicon Etcher is a low- and high-frequency ICP etch system for deep silicon trench etching of a single 6-inch substrate.

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Pumps are not included

What do the numbers mean?

Vacuum & pumping1

Pumps are not included[1]
Accurate?

Wafer handling2

Wafer size
Manual wafer lock[1]
Accurate?
The system can be used for deep Si trench etching of a single 6" [150mm] substrate[1]
Accurate?

Configuration & options2

Low and high frequency ICP (Inductively Coupled Plasma) etch system.[1]
Accurate?
The ASE (Advanced Silicon Etch) process consists of alternating cycles of etching and protective polymer deposition to achieve high aspect ratios.[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationPumps are not included[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the Multiplex ASE ICP Deep Silicon are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Multiplex ASE ICP Deep Silicon are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Multiplex ASE ICP Deep Silicon are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Multiplex ASE ICP Deep Silicon are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the Multiplex ASE ICP Deep Silicon is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Multiplex ASE ICP Deep Silicon are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]Inventory photo
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Last updated Jul 29, 2026.

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