STS

Wafer size
Manual wafer lock
Vacuum
Pumps are not included[1]
Documented failure modes, common issues, and field considerations.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the Multiplex ASE ICP Deep Silicon are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Multiplex ASE ICP Deep Silicon are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Multiplex ASE ICP Deep Silicon are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Multiplex ASE ICP Deep Silicon are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Multiplex ASE ICP Deep Silicon is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Multiplex ASE ICP Deep Silicon are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Jul 29, 2026.
The Tegal 1511e is a tri-electrode dual-frequency plasma etch system for processing three- to six-inch wafers.
General referenceLam Research 2300 is an etch system used for pattern transfer in semiconductor processing. It belongs to the class of plasma-based etch equipment used to remove selected material from a wafer according to a patterned mask.