SUSS MicroTec

Plate 01Karl Suss MA150cc Mask Aligner (ID# 3532)
Plate 02Refurbishing and Converting a SUSS MA150cc to a MA150cc/e
Plate 03Suss MA150 Mask Aligner De-Installation by ClassOne Equipment
The SUSS MicroTec MA 150 CC Mask is a mask aligner used in lithography. It is a topside-alignment system with cassette-to-cassette operation and can run in automatic or manual mode.[2]
A mask aligner transfers a pattern from a photomask to a wafer by aligning the mask to the wafer and exposing the coated surface to ultraviolet light. In this class of equipment, alignment optics and microscope viewing are used to position features before contact exposure.
Mask alignment and exposure are part of photolithography, positioned after wafer preparation and resist coating and before resist development and downstream pattern transfer steps. A cassette-to-cassette aligner supports batch handling between these stages.
Mask aligners are used for photolithographic patterning in semiconductor manufacturing and related microfabrication work. They are applied when a patterned exposure step is needed on wafer surfaces.
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The following facts about the MA 150 CC Mask are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA 150 CC Mask are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MA 150 CC Mask are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MA 150 CC Mask are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA 150 CC Mask are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA 150 CC Mask is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 29, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.