SUSS MicroTec

In a lithography line, a mask aligner is a contact or proximity exposure tool used to transfer a pattern from a photomask to a substrate. It is used for aligned exposure work rather than for deposition, etch, or metrology.
A mask aligner operates by bringing a patterned mask into precise alignment with a coated substrate and then exposing the resist to actinic light. The alignment stage and chuck system position the substrate, while the optical exposure path projects or couples the mask pattern onto the resist area.
This class of equipment sits in the photolithography segment of semiconductor processing, after substrate preparation and resist coating and before development and the downstream pattern-transfer steps that follow exposure.
Mask aligners are used for patterned lithography on substrates in semiconductor and microfabrication work, including processes that require registered exposure of photoresist through a mask.
Documented failure modes, common issues, and field considerations.
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It is a mask aligner used for lithography.[2]
The following facts about the MA 200 CC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA 200 CC are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MA 200 CC are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MA 200 CC are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the MA 200 CC is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MA 200 CC are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Jul 29, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.