SUSS MicroTec
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The SUSS MicroTec MA 200 CC Mask Aligner is a mask aligner used in photolithography.[3][1]
A mask aligner transfers a pattern from a photomask to a photosensitive layer by bringing the mask and substrate into alignment and exposing the coated surface to light. The machine supports contact-style lithographic pattern transfer used in microfabrication.
The machine sits in the lithography portion of the process flow, where patterned exposure defines features on a photoresist-coated substrate before later etch or deposition steps use that pattern.
Mask aligners are used for patterning photoresist in semiconductor and microfabrication workflows, including processing of wafers and other planar substrates that require optical pattern transfer.
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The following facts about the MA 200 CC Mask are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the MA 200 CC Mask are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA 200 CC Mask are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MA 200 CC Mask are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MA 200 CC Mask are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA 200 CC Mask are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Jul 29, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.