SUSS MicroTec

Plate 01Exposure using contact aligner (Suss MA6)
Plate 02Karl Suss MA6 Mask Aligner - Standard Operating Procedures
Power
1000 Watt Power Supply[2]
Performance
with Infrared Alignment[7]
Optics
IR Back Side Illumination[2]
The SUSS MicroTec MA 6 Mask is a mask aligner used in photolithography to transfer circuit or pattern features from a photomask to a wafer by contactless or proximity alignment and exposure.
A mask aligner holds a wafer and a photomask in a controlled optical and mechanical arrangement, aligns their patterns with microscope-assisted viewing, and then exposes the wafer so the mask pattern can be transferred into a resist-coated surface. In this class of tool, alignment accuracy and stable illumination are central to the process.
A mask aligner sits in the lithography section of the fabrication flow, after surface preparation and resist coating and before development and pattern transfer into the underlying film stack or substrate. It is used before downstream etch, deposition, or lift-off steps that rely on the resist pattern.
Mask aligners are used for photolithographic patterning in semiconductor and related microfabrication work, including device prototyping, process development, and production of structures that do not require the resolution of stepper-based projection lithography.
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It is a lithography mask aligner used to align a photomask to a resist-coated substrate and expose the resist with the mask pattern.
It performs optical pattern transfer by exposing photoresist through an aligned mask, creating a patterned resist image for later fabrication steps.
It is used early in the patterning sequence, after resist preparation and before development and downstream pattern transfer operations.
Such systems are used on substrates that need precisely aligned optical patterning, especially in semiconductor, microdevice, and precision microfabrication workflows.
Alignment places the mask pattern accurately relative to features already present on the substrate so the new exposure lands in the intended location.
The following facts about the MA 6 Mask are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA 6 Mask are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MA 6 Mask are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MA 6 Mask are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA 6 Mask are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA 6 Mask is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 29, 2026.
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