SUSS MicroTec

Wafer size
wafers up to 4″ (MA4) or 6″ (MA6); also 1 cm² pieces
Optics
< 1 µm[1]
Process applications and technology nodes documented for this tool.
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The following facts about the MA6/MA4 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA6/MA4 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MA6/MA4 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA6/MA4 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA6/MA4 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MA6/MA4 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Last updated Jul 29, 2026.
The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.