MA6/MA4

The SUSS MicroTec MA6/MA4 is a mask aligner used in photolithography. The SUSS MicroTec MA6/MA4 uses UV light to transfer patterns from photomasks onto substrates coated with photoresist. The MA4 accommodates wafers up to 4 inches, while the MA6 accommodates wafers up to 6 inches. The MA6 and MA4 also accommodate 1 cm2 pieces.^[1][3][2]

The SUSS MicroTec MA6/MA4 uses exposure modes that include hard contact, soft contact, proximity, and flood. The SUSS MicroTec MA6/MA4 operates over a spectral range of 365 nm to 405 nm. The SUSS MicroTec MA6/MA4 has exposure resolution below 1 µm. The SUSS MicroTec MA6/MA4 has topside alignment accuracy of 500 nm. The SUSS MicroTec MA6/MA4 includes a CCD camera and monitor for image capture. The SUSS MicroTec MA6/MA4 has uniformity of plus or minus 5 percent over the exposure area.^[1][3]

Photolithography tools of this class sit at the pattern-definition stage of microfabrication. A mask aligner is typically used after substrate cleaning, dehydration, and photoresist coating with a soft bake, and before development and the follow-on pattern transfer or lift-off step. The patterned resist produced by the exposure step serves as a temporary stencil for later deposition, etch, plating, or surface modification operations.

Mask aligners are used to create patterned resist layers for microscale fabrication on wafers and small substrates. Typical uses include defining structures for etching, deposition patterning, lift-off, surface treatment, and mold or stamp fabrication in research and pilot-line work.