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Temescal

FC-2000

Deposition100mmTemescal FC-2000 family
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The Temescal FC-2000 is a bell jar deposition system. The Temescal FC-2000 is a load-locked evaporation system. The Temescal FC-2000 supports 13x100mm wafers.[1][2][3]

FC-2000 — web.archive.org
Fig. 01FC-2000web.archive.org[1]
  • Plate 01Temescal FC2000 Inv# 64,981 Egun Deposition

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  • Plate 02Temescal FC2000 Inv# 64,981 Thermal Source Deposition

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Wafer size

100mm

Power

10 kV SIMBA 2 HV supply, max 15 kW[3]

What it is

General reference — not yet source-verified

Deposition systems of this class are vacuum evaporation tools used to form thin films on substrates. Bell jar evaporators are typically used where process flexibility, source access, and a relatively direct line of sight between source and substrate are important.

Where it fits in the process flow

General reference — not yet source-verified

Evaporation tools of this class are used in thin-film module areas after substrate preparation and before pattern transfer completion, liftoff, packaging, or additional film stack steps. Such tools commonly sit alongside sputter and other deposition methods when a process flow calls for directional coating, multilayer metal stacks, or materials suited to evaporation.

Applications

General reference — not yet source-verified

Machines in this class are commonly used to deposit conductive, adhesion, barrier, and noble metal films on wafers and small substrates. Electron beam evaporation is often selected for lift-off patterning and other applications where directional flux and low process gas involvement are useful.

  • Small-scale production
  • Research and development

What do the numbers mean?

Power & electrical2

Electron beam power supply
Temescal model CV-6SLX electron beam power supply[1]
Accurate?
Power supply
10 kV SIMBA 2 HV supply, max 15 kW[3]
Accurate?

Vacuum & pumping3

Vacuum handling
Allows the source to remain under vacuum during substrate reloading[1]
Accurate?
Source behavior during reload
Allows the source to remain under vacuum during substrate reloading[1]
Accurate?
Substrate reload behavior
Allows the source to remain under vacuum during substrate reloading[1]
Accurate?

Wafer handling9

Standard source-to-substrate distance
19.5 in[1]
Accurate?
Optional source-to-substrate distance with extension collar
27.5 in[1]
Accurate?
Wafer count
13x100mm wafers[2]
Accurate?
Substrate heating
Substrate heating by quartz lamp[3]
Accurate?
Optional source-to-substrate distance
27.5 in with source well extension collar[1]
Accurate?
Wafer capacity option
100-mm wafers[1]
Accurate?
Wafer capacity
13 x 100-mm wafers[2]
Accurate?
Wafer handling
Sample can be mounted perpendicular or under a fixed angle[3]
Accurate?
Optional substrate fixture
Additional LN2 cooled substrate fixture available[3]
Accurate?

Optics & imaging2

Source tray
Supports multiple electron beam and resistance sources[1]
Accurate?
Source compatibility
Supports multiple electron beam and resistance sources[1]
Accurate?

Control & software3

Control system
Temescal Control System (TCS)[1]
Accurate?
Deposition controller
Inficon XTC/3 deposition controller[1]
Accurate?
Beam sweep controller
Temescal SuperSweep64 programmable beam sweep controller[1]
Accurate?

Configuration & options11

System name
Temescal FC-2000 deposition system[1]
Accurate?
System type
Bell jar deposition system[1]
Accurate?
Operation
Fast-cycle, load-locked system[1]
Accurate?
Bell jar diameter
20 in (508 mm)[1]
Accurate?
FC-2000 source tray diameter
18 in (457 mm)[1]
Accurate?
Operation
Fast-cycle, load-locked evaporation system[1]
Accurate?
Ion source
3 cm ion source for argon sputter cleaning[3]
Accurate?
Model
FC-2000[1]
Accurate?
Application
Small-scale production and R&D[1]
Accurate?
Operating mode
Fast-cycle, load-locked[1]
Accurate?
Source tray diameter
18 in (457 mm)[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
BJD-2000——Non-load-locked version of the FC/BJD-2000 line.web.archive.org[1]
FC-2000——Fast-cycle, load-locked version that allows the source to remain under vacuum during substrate reloading.web.archive.org[1]
FC-2800——The sources state that a field upgrade kit allows conversion into an FC-2800.web.archive.org[1]
BCD-2800——The sources state that a field upgrade kit allows conversion into a BCD-2800.web.archive.org[1]
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What replaced it?

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Vacuum handlingAllows the source to remain under vacuum during substrate reloading[1]
  • Electron beam power supplyTemescal model CV-6SLX electron beam power supply[1]
  • Source behavior during reloadAllows the source to remain under vacuum during substrate reloading[1]
  • Power supply10 kV SIMBA 2 HV supply, max 15 kW[3]
  • Substrate reload behaviorAllows the source to remain under vacuum during substrate reloading[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What source-to-substrate distances are available on the Temescal FC-2000?

The Temescal FC-2000 has a standard source-to-substrate distance of 19.5 inches. The Temescal FC-2000 can be configured with an optional source well extension collar for a 27.5 inch source-to-substrate distance.[1][2]

What control system does the Temescal FC-2000 use?

The Temescal FC-2000 uses the Temescal Control System. The Temescal Control System provides recipe-driven process and vacuum control, process variable monitoring, process and historical trend tracking, and process data logging. The Temescal Control System operates in Auto, Manual, and Service modes.[1][2]

What source hardware can the Temescal FC-2000 support?

The Temescal FC-2000 source tray supports multiple electron beam and resistance sources. The Temescal FC-2000 can be equipped with a Temescal 4- or 6-pocket standard or PopTop turret source. The Temescal FC-2000 also offers options for up to three resistance sources and one additional fixed electron beam source.[1][2]

Not publicly documented

The following facts about the FC-2000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC-2000 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the FC-2000 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the FC-2000 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the FC-2000 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the FC-2000 are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]temescal.ferrotec.com — temescal.ferrotec.comtemescal.ferrotec.com
  3. [3]tudelft.nl — tudelft.nltudelft.nl
  4. [4]Product Quickfinder — web.archive.orgweb.archive.org
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Last updated Oct 17, 2026.

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