Temescal
The Temescal FC-2000 is a bell jar deposition system. The Temescal FC-2000 is a load-locked evaporation system. The Temescal FC-2000 supports 13x100mm wafers.[1][2][3]

Plate 01Temescal FC2000 Inv# 64,981 Egun Deposition
Plate 02Temescal FC2000 Inv# 64,981 Thermal Source Deposition
Wafer size
100mm
Power
10 kV SIMBA 2 HV supply, max 15 kW[3]
Deposition systems of this class are vacuum evaporation tools used to form thin films on substrates. Bell jar evaporators are typically used where process flexibility, source access, and a relatively direct line of sight between source and substrate are important.
Evaporation tools of this class are used in thin-film module areas after substrate preparation and before pattern transfer completion, liftoff, packaging, or additional film stack steps. Such tools commonly sit alongside sputter and other deposition methods when a process flow calls for directional coating, multilayer metal stacks, or materials suited to evaporation.
Machines in this class are commonly used to deposit conductive, adhesion, barrier, and noble metal films on wafers and small substrates. Electron beam evaporation is often selected for lift-off patterning and other applications where directional flux and low process gas involvement are useful.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| BJD-2000 | — | — | Non-load-locked version of the FC/BJD-2000 line. | web.archive.org[1] |
| FC-2000 | — | — | Fast-cycle, load-locked version that allows the source to remain under vacuum during substrate reloading. | web.archive.org[1] |
| FC-2800 | — | — | The sources state that a field upgrade kit allows conversion into an FC-2800. | web.archive.org[1] |
| BCD-2800 | — | — | The sources state that a field upgrade kit allows conversion into a BCD-2800. | web.archive.org[1] |
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The Temescal FC-2000 has a standard source-to-substrate distance of 19.5 inches. The Temescal FC-2000 can be configured with an optional source well extension collar for a 27.5 inch source-to-substrate distance.[1][2]
The Temescal FC-2000 uses the Temescal Control System. The Temescal Control System provides recipe-driven process and vacuum control, process variable monitoring, process and historical trend tracking, and process data logging. The Temescal Control System operates in Auto, Manual, and Service modes.[1][2]
The Temescal FC-2000 source tray supports multiple electron beam and resistance sources. The Temescal FC-2000 can be equipped with a Temescal 4- or 6-pocket standard or PopTop turret source. The Temescal FC-2000 also offers options for up to three resistance sources and one additional fixed electron beam source.[1][2]
The following facts about the FC-2000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC-2000 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the FC-2000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FC-2000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FC-2000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the FC-2000 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 17, 2026.
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