P 12 XL Wafer

A wafer prober is a semiconductor test handling machine that positions a wafer so probe needles or probe cards can contact die pads for electrical measurement. Wafer probers are used before singulation to support device characterization, parametric measurement, and wafer sort. Fully automatic wafer probers generally combine wafer handling, alignment, indexing, and controlled contact between the wafer and a probe interface.

Wafer probers transfer a wafer onto a chuck, align the wafer to the probing coordinate system, and step from site to site so test hardware can contact each die or test structure. Automatic wafer probers generally coordinate motion, contact detection, and recipe driven sequencing so electrical tests can be repeated across the wafer. A heated chuck configuration allows probing under elevated chuck temperature conditions, while ambient operation supports measurements near normal room conditions.

Wafer probers sit in the electrical test flow between wafer fabrication and assembly. Wafer probers are used after device structures and interconnect have been formed, when test pads or bond pads are available for contact. Wafer probing commonly feeds wafer sort, process monitoring, and disposition decisions before dicing and packaging.

Wafer probers are used for electrical probing of semiconductor wafers during device development, process control, and production test. Wafer probers can support measurements on integrated circuits, scribe line structures, and dedicated test patterns. Heated chuck capability is used when test programs require temperature conditioned measurements.