Tokyo Electron
Precio Automatic Wafer
The Tel Precio Automatic Wafer Prober is an automatic wafer prober for 12-inch wafers. The Tel Precio Automatic Wafer Prober features a single FOUP wafer loader on the right side. The Tel Precio Automatic Wafer Prober is rated for 200 V, 30 A, 50/60 Hz and 2.9 kVA single-phase power.[1][2]
Wafer size
Single Foup Wafer Loader (Right)
Power
50/60 Hz[1]
What it is
General reference — not yet source-verifiedA wafer prober is test floor equipment used to position a semiconductor wafer so electrical contact can be made to individual die or test structures before the wafer is diced and packaged. Automatic wafer probers are generally paired with external test instrumentation and a probe card so the system can step from site to site across the wafer under programmed control.
How it works
General reference — not yet source-verifiedWafer probers generally load a wafer, align it on a chuck, move the wafer to programmed coordinates, and bring a probe card into controlled contact with pads or bumps for electrical measurement. Wafer probers generally exchange commands and results with a tester while the prober handles wafer presentation, indexing, and contact sequencing.
Where it fits in the process flow
General reference — not yet source-verifiedWafer probing sits in electrical test flow after wafer fabrication has created the structures to be measured and before singulation and package level handling. Wafer probing is commonly used for wafer sort, parametric checking, device screening, and collection of die level test data that guides downstream disposition.
Applications
General reference — not yet source-verifiedAutomatic wafer probers are used where repeatable electrical contact is needed across many sites on a wafer. Automatic wafer probers support device test programs, process monitoring structures, and engineering characterization work on finished wafers before assembly.
What do the numbers mean?
Power & electrical4
- 50/60 Hz[1]
Wafer handling7
- Single Foup Loader (Right)[1]
Control & software4
Configuration & options13
- Top Plate Unit, V93K PIB & Pogo Docking Type[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Accretech UF 300 A Automatic Wafer— Same function class: Test & Probe, UnknownCompare in depthsource[1]
- Accretech UF 3000 Automatic Wafer— Same function class: Test & Probe, UnknownCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How does an automatic wafer prober align the wafer without damaging the die?General reference — not yet source-verified
The prober uses optical pattern recognition systems to locate alignment marks on the wafer, then makes precise mechanical adjustments. The chuck moves slowly and gently to contact the probe needles with the pads, using controlled force to avoid damage.
Can the prober handle different wafer sizes?General reference — not yet source-verified
Many systems in this class are designed to accommodate a range of wafer sizes by changing the chuck and adjusting the alignment recipe. The exact sizes depend on the configuration, but the class generally supports multiple substrate diameters.
What determines the throughput of an automatic wafer prober?General reference — not yet source-verified
Throughput depends on the speed of wafer loading, alignment time, the number of dies, and the time spent per die for electrical testing. Optimization of the stepping sequence and parallel testing of multiple dies can increase throughput, but the class inherently has this trade-off between accuracy and speed.
Not publicly documented
The following facts about the Precio Automatic Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Precio Automatic Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Precio Automatic Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Precio Automatic Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Precio Automatic Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Precio Automatic Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (12)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]inventory listing
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]Inventory photo
- [9]Inventory photo
- [10]Inventory photo
- [11]inventory listing
- [12]Equipment inventory listing
Last updated Oct 16, 2026.
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