Tactras

The Tokyo Electron Tactras is a series of plasma etch systems designed for processing 300 mm wafers.^[2][1][3]

The Tactras platform features a space-saving rectangular cluster design and supports up to six etch chambers.^[1][3][5]

The Tactras system uses a common base design that can be configured for different etch applications, including dielectric etch, conductor etch, and reactive ion etch.^[1][3][5]

The Tactras platform can be configured with multiple independent etch chambers, each capable of handling different processes, which allows for parallel processing of wafers in a cluster tool arrangement.^[1][3][5]

The system's rectangular cluster design positions chambers facing each other horizontally, which contributes to a reduced footprint.^[1][5]

The Tactras system processes 300 mm wafers for advanced semiconductor manufacturing, and a variant called Tactras-UDEMAE was introduced in 2021 specifically for the production of power devices on 300 mm wafers.^[4][3]

The Tactras platform supports applications including high aspect ratio hole etch, trench etch, mask and dielectric etch, and BEOL dielectric etch.^[1]

The system is used for etching poly, dielectric, and conductor films, as well as for reactive ion etch processes.^[2][3]