WDF DP Frame

A wafer prober is a semiconductor test tool that brings probe contacts into alignment with pads or bumps on a wafer so electrical measurements can be made before singulation. A prober typically works together with external test instrumentation while providing controlled wafer handling, positioning, and contact at the probe interface.

A wafer prober loads and positions a wafer on a chuck, moves the wafer relative to a probe card or probe head, and establishes contact so dies or test structures can be measured. A frame-style prober generally serves as the mechanical and motion platform for alignment, touchdown, and stepping across wafer locations during electrical test.

Wafer probing sits in the electrical test flow after wafer fabrication has produced structures that can be contacted and before wafer singulation and final packaging. Probe operations are used to screen devices, characterize process results, and collect die-level electrical data while the devices are still on the wafer.

Wafer probers are used for die sort, parametric measurement, process monitoring, failure analysis support, and engineering characterization. Wafer probers can be applied to product wafers and to dedicated test structures when electrical contact to on-wafer features is required.