Mini Tytan 4600

The Tystar Mini-Tytan 4600 is a horizontal furnace system for diffusion, oxidation, and LPCVD applications. The Tystar Mini-Tytan 4600 is configured as one furnace stack with four vacuum tubes. The Tystar Mini-Tytan 4600 includes two atmospheric pressure tubes and two low-pressure tubes. The Tystar Mini-Tytan 4600 processes wafers up to 6 inches, or 150 mm. The Tystar Mini-Tytan 4600 can perform low-temperature oxide processes and deposition of silicon nitride and polysilicon.^[1][3]

The Tystar Mini-Tytan 4600 uses an MFS-460 mass flow system and a DCS-30 data collection system. The Tystar Mini-Tytan 4600 supports temperatures up to 850 °C for silicon nitride processes and up to 650 °C for all others. The Tystar Mini-Tytan 4600 supports maximum deposition thickness of 5 µm. The Tystar Mini-Tytan 4600 supports LTO processes below 450 °C.^[1]

Thermal furnace steps are typically inserted after wafer cleaning and before later patterning, etch, implantation, or metallization steps that depend on the deposited or grown layer. Diffusion furnaces and LPCVD furnaces are commonly used when a process flow needs conformal films, thermal oxides, or heat treatment across a batch of wafers. Furnace processing often sits in module flows that build dielectric layers, conductive films, masking layers, or structural films for later micromachining.

Batch thermal tools of this class are used to create films and thermal treatments that become active device layers, insulating layers, masking layers, or mechanical layers. Furnace-based oxidation and LPCVD are commonly chosen for processes that need coverage on shaped topography, stable film properties, or simultaneous processing of many substrates.