Ulvac
The Ulvac Ei 7 L is an e-beam evaporator equipped with an auto loader (EFEM), wafer transfer system, load lock chamber, process chamber, and operation panel. The Ulvac Ei 7 L uses an EGN-4020 evaporation source with 40 ml x 20 pockets and a 10 kW EB power supply. The Ulvac Ei 7 L can deposit metals including Al, Ni, Ti, Pt, and Au.[1]

Wafer size
Auto loader (EFEM), wafer transfer system, load lock chamber, process chamber, operation panel.
Power
10 kw[1]
Vacuum
Exhaust System:[1]
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The system uses an EGN-4020 evaporation source with 40 pockets, each having a 20 ml capacity.[1]
The exhaust system uses a dry pump (model PS1802-AN for 200 volt 60 hertz) and a cryogenic pump (model CRYO-U20P).[1]
The following facts about the Ei 7 L E-Beam are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Ei 7 L E-Beam are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Ei 7 L E-Beam are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Ei 7 L E-Beam are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Ei 7 L E-Beam are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Ei 7 L E-Beam is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 13, 2026.
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