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Ulvac

SDP 570 VMS In Line

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The Ulvac SDP 570 VMS In Line is a deposition sputtering system. The Ulvac SDP 570 VMS In Line uses DC magnetron sputtering. The Ulvac SDP 570 VMS In Line has a takt time of 2.5 minutes.[1][2]

SDP 570 VMS In Line — Inventory photo
Fig. 01SDP 570 VMS In LineInventory photo[2]

Power

3 phase, 220 V, 60 Hz, 615 kVA[2]

Vacuum

Vacuum Conditions:[2]

Performance

2.5 min Film Thickness - 1100 Å[2]

What it is

The Ulvac SDP 570 VMS In Line is a deposition tool for sputtering. The Ulvac SDP 570 VMS In Line uses a direct-current magnetron sputtering method. The Ulvac SDP 570 VMS In Line is configured for manual substrate loading and a glass substrate material.[2][1]

How it works

The Ulvac SDP 570 VMS In Line includes a preparation chamber, an isolation room, a removal chamber, and a return conveyor. The Ulvac SDP 570 VMS In Line includes a sputtering chamber with input, cathode, and output chambers.[2][1]

Where it fits in the process flow

General reference — not yet source-verified

A sputtering deposition tool sits in the thin-film formation stage of a fabrication line. A sputtering tool usually follows substrate preparation and precedes later patterning or integration steps that use the deposited film.

Applications

General reference — not yet source-verified

Sputtering is used for conductive films, barrier films, and other thin-film layers in vacuum processing. Sputtering tools are used where controlled film thickness and uniform coverage are required.

What do the numbers mean?

Power & electrical1

Required Electric Power
3 phase, 220 V, 60 Hz, 615 kVA[2]
Accurate?

Vacuum & pumping7

Vacuum Conditions:[2]
Accurate?
Preheat Chamber: ≤ 1 × 10⁻⁶ Torr - Sputtering Chamber: ≤ 1 × 10⁻⁶ Torr - Isolation Chamber: ≤ 1 × 10⁻⁶ Torr[2]
Accurate?
Pump Down Time:[2]
Accurate?
Preheat Chamber: Approx. 45 seconds from atmospheric pressure to 0.2 Torr - Removal Chamber: Approx. 45 seconds from atmospheric pressure to 0.2 Torr[2]
Accurate?
Vacuum conditions
Preheat Chamber: ≤ 1 × 10⁻⁶ Torr; Sputtering Chamber: ≤ 1 × 10⁻⁶ Torr; Isolation Chamber: ≤ 1 × 10⁻⁶ Torr[2]
Accurate?
Pump down time
Preheat Chamber: Approx. 45 seconds from atmospheric pressure to 0.2 Torr; Removal Chamber: Approx. 45 seconds from atmospheric pressure to 0.2 Torr[2]
Accurate?
Sputtering pressure
8 × 10⁻⁴ to 8 × 10⁻³ Torr[2]
Accurate?

Wafer handling3

Loader / Unloader
Manual substrate Loading)[2]
Accurate?
Substrate Material
Glass[2]
Accurate?
Substrate on both sides
Yes[2]
Accurate?

Gas & chemistry2

Required N2 gas
0.5 kg/cm²G; Max: approx. 202 Nm³/hr; Normal: approx. 20.0 Nm³/hr[2]
Accurate?
Required process gases
Ar: 0.5 kg/cm²G, sccm; X: 0.5 kg/cm²G, sccm; Y: 0.5 kg/cm²G, sccm; Z: 0.5 kg/cm²G, sccm[2]
Accurate?

Optics & imaging1

Required compressed air
5–7 kg/cm²G; Approx. 105.0 Nm³/hr (average)[2]
Accurate?

Performance2

Thickness uniformity
2.5 min Film Thickness - 1100 Å[2]
Accurate?
Thickness uniformity
2.5 min[2]
Accurate?

Dimensions & facilities3

Required Floor Space
Approx. W 7000 × L 32,000 × H 3000 mm[2]
Accurate?
Required water cooling
2.5 kg/cm²G; Approx. 25.2 m³/hr; Water temperature: 15–30 °C[2]
Accurate?
Temperature
2.5 kg/cm²G - Approx. 25.2 m³/hr - Water temperature: 15–30 °C[2]
Accurate?

Configuration & options15

Sputter Method
(DC Magnetron Sputtering)[2]
Accurate?
Takt Time (Cycle Time)
2.5 min[2]
Accurate?
Elevator[2]
Accurate?
Preparation Chamber[2]
Accurate?
Isolation Room[2]
Accurate?
Removal Chamber[2]
Accurate?
Return Conveyor[2]
Accurate?
Process Chamber:[2]
Accurate?
Sputtering Chamber[2]
Accurate?
Input Chamber -> Cathode Chamber -> Output Chamber[2]
Accurate?
Sputtering Conditions:[2]
Accurate?
Target Attachment Method
Metal bonding to backing plate[2]
Accurate?
Target size
144 mm × 690 mm × 6 mm[2]
Accurate?
Process chamber
Sputtering Chamber; Input Chamber -> Cathode Chamber -> Output Chamber[2]
Accurate?
Configuration elements
Elevator; Preparation Chamber; Isolation Room; Removal Chamber; Return Conveyor[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Required Electric Power3 phase, 220 V, 60 Hz, 615 kVA[2]
  • ConfigurationVacuum Conditions:[2]
  • ConfigurationPreheat Chamber: ≤ 1 × 10⁻⁶ Torr - Sputtering Chamber: ≤ 1 × 10⁻⁶ Torr - Isolation Chamber: ≤ 1 × 10⁻⁶ Torr[2]
  • ConfigurationPump Down Time:[2]
  • ConfigurationPreheat Chamber: Approx. 45 seconds from atmospheric pressure to 0.2 Torr - Removal Chamber: Approx. 45 seconds from atmospheric pressure to 0.2 Torr[2]
  • Vacuum conditionsPreheat Chamber: ≤ 1 × 10⁻⁶ Torr; Sputtering Chamber: ≤ 1 × 10⁻⁶ Torr; Isolation Chamber: ≤ 1 × 10⁻⁶ Torr[2]
  • Pump down timePreheat Chamber: Approx. 45 seconds from atmospheric pressure to 0.2 Torr; Removal Chamber: Approx. 45 seconds from atmospheric pressure to 0.2 Torr[2]
  • Sputtering pressure8 × 10⁻⁴ to 8 × 10⁻³ Torr[2]
  • Required N2 gas0.5 kg/cm²G; Max: approx. 202 Nm³/hr; Normal: approx. 20.0 Nm³/hr[2]
  • Required process gasesAr: 0.5 kg/cm²G, sccm; X: 0.5 kg/cm²G, sccm; Y: 0.5 kg/cm²G, sccm; Z: 0.5 kg/cm²G, sccm[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What deposition method does the Ulvac SDP 570 VMS In Line use?

The Ulvac SDP 570 VMS In Line uses DC magnetron sputtering.[2][1]

Not publicly documented

The following facts about the SDP 570 VMS In Line are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SDP 570 VMS In Line are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the SDP 570 VMS In Line are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the SDP 570 VMS In Line are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the SDP 570 VMS In Line are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the SDP 570 VMS In Line is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]SDP 570 VMS In Line — Ulvac | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
  2. [2]Inventory photo
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Last updated Oct 10, 2026.

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