YES

6112

Thermal / Diffusion 8 in. wafersIntroduced 2000YES 6112 family

Research Quality: 30% complete

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YES6112

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Wafer size

8 in. wafers

Introduced

2000

Performance

2 full loads/hr.^[1]

What is it?

The sources list YES-6112 as a Vacuum Bake/Vapor Prime product and describe it as an ultra-clean system. The product page states that Yield Engineering Systems has designed and manufactured semiconductor equipment since 1980 and includes YES-6112 among its Vacuum Bake/Vapor Prime Systems.

What can it run?

Process applications and technology nodes documented for this tool.

Vacuum bake
Vapor prime
Pre-programmed dehydration
Vapor deposition of a priming agent

What do the numbers mean?

Wafer handling3

Capacity: 4 cassettes of 8 in. wafers^[1]
Cleanliness: < 10 x 0.5 - micron particles per 8-in. wafer^[1]
HMDS usage: <7 ml/200 wafers (>50 prime cycles/pint)^[1]

Performance1

Throughput: 2 full loads/hr.^[1]

Configuration & options2

Temperature: 160°C max^[1]
Outer system: stainless steel^[1]

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Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the 6112 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6112 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6112 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6112 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6112 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6112 is not on record.
Answerable by: an OEM datasheet or a fab qualification report