YES
Process applications and technology nodes documented for this tool.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| YES 6-2P-CP | — | — | Listed as a different wafer-size configuration in the same PB Series overview; stated for 150 mm wafers. | web.archive.org[1] |
| YES 12-2P-CP | — | — | Listed as a different wafer-size configuration in the same PB Series overview; stated for 300 mm wafers. | web.archive.org[1] |
| YES 8-2P-CP | — | — | Specified for 200 mm wafers. | web.archive.org[1] |
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The following facts about the 8-2P-CP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8-2P-CP are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 8-2P-CP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8-2P-CP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8-2P-CP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 8-2P-CP are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Last updated Jul 29, 2026.
The CEE 200 Bake Plate is a bake plate for up to 200mm wafers with Internal OS software and 208V power.
The YES 450PB is a high-temperature vacuum cure oven series for MEMS and semiconductor process applications, with related stainless-steel cassette accessories designed for the series.