Waferpedia

YES

8-2P-CP

Thermal / Diffusion200mmYES 8-2P-CP family
Research Quality: 30% complete
YES8-2P-CP
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What is it?

The sources describe the YES-PB Series as a manual-load cure oven line for MEMS and semiconductor process applications, with the 8-2P-CP identified as the 200 mm wafer configuration. The line is presented for polyimide, BCB, low-k dielectric, copper anneal, and related cure applications, and includes vertical laminar airflow, a coalescing condensate trap, and an air-only cooling package.

What can it run?

Process applications and technology nodes documented for this tool.

  • Polyimide/PBO cure
  • BCB bake
  • Low temp polymers cure
  • Copper anneal
  • Low-K dielectric cure
  • Copper oxide removal
  • Aluminum anneal
  • WLP/RDL applications
  • MEMS and semiconductor process applications

What do the numbers mean?

Wafer handling1

Wafer size
200 mm wafers[1]
Accurate?

Control & software2

Process interface
touch screen interface enables the process to be fully automated[2]
Accurate?
Condensate control
coalescing condensate trap assembly[2]
Accurate?

Configuration & options5

Model
8-2P-CP[1]
Accurate?
Series
YES-PB Series[1]
Accurate?
Load type
manual load[2]
Accurate?
Cooling package
uses air, no water[2]
Accurate?
Airflow
vertical laminar airflow[2]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
YES 6-2P-CPListed as a different wafer-size configuration in the same PB Series overview; stated for 150 mm wafers.web.archive.org[1]
YES 12-2P-CPListed as a different wafer-size configuration in the same PB Series overview; stated for 300 mm wafers.web.archive.org[1]
YES 8-2P-CPSpecified for 200 mm wafers.web.archive.org[1]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 8-2P-CP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8-2P-CP are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 8-2P-CP are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 8-2P-CP are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 8-2P-CP is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 8-2P-CP are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.orgweb.archive.org
  3. [3]Manual-Load High-Temperature Cure Ovens for MEMS & Semiconductor Process Applicationsweb.archive.orgweb.archive.org
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Last updated Jul 29, 2026.

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