Waferpedia

Mattson

8800

Thermal / Diffusion200mm0.25-micronIntroduced third-generationMattson 8800 family
Research Quality: 40% complete
8800 — web.archive.org
Fig. 018800web.archive.org[1]

Wafer size

200mm

Introduced

1997

Node / era

0.25-micron

Performance

Significantly boosts throughput[1]

What is it?

The Mattson 8800 is described as a third-generation RTP tool for 0.25-micron process requirements. It is a 200 mm single-wafer RTP tool with proprietary design features intended to improve temperature uniformity, repeatability, and throughput.

What can it run?

Process applications and technology nodes documented for this tool.

  • TiSi2/TiN
  • CoSi2
  • BPSG flow/densification
  • Gate oxide anneal and nitridation (NO, N2O, NH3)
  • Low temperature copper anneal
  • PZT anneals
  • High k dielectric anneal in N2O

What do the numbers mean?

Wafer handling5

Wafer size
200 mm[1]
Accurate?
Wafer format
Single-wafer[1]
Accurate?
Ceramic Shield option
Backside emissivity independence and better wafer-to-wafer repeatability[1]
Accurate?
High temperature end effector
High-throughput configuration[1]
Accurate?
Swivel cassettes with independent swivels
Higher throughput[1]
Accurate?

Gas & chemistry1

High process purge gas flow
Fast chamber purging for high-throughput configuration[1]
Accurate?

Performance5

Temperature performance
Improves temperature uniformity and repeatability[1]
Accurate?
Throughput
Significantly boosts throughput[1]
Accurate?
Nitrogen curtain
Minimum pre-purge time and high-throughput configuration[1]
Accurate?
ez-DTC
High-throughput configuration and improved control[1]
Accurate?
Standard slip-free ring package
High temperature slip-free processing and improved uniformity[1]
Accurate?

Configuration & options4

Tool type
Third-generation RTP tool[1]
Accurate?
Process target
0.25-micron process requirements[1]
Accurate?
Double O-ring seal system
Prevents product loss[1]
Accurate?
Certifications
CE certified and UL listed[1]
Accurate?

Vintage & configurations

  1. 1997Award recognition[1]

    The 8800 won Semiconductor International's Editor's Choice Best Product Award in 1997.

  2. 1997Product award[1]

    The 8800 won Semiconductor International's Editor's Choice Best Product Award in 1997.

Interested in this tool?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • High process purge gas flowFast chamber purging for high-throughput configuration[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 8800 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented variants, configuration options, or revision breakpoints of the 8800 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 8800 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 8800 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • No publicly documented compatible parts, consumables, or accessories for the 8800 are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the 8800 are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.orgweb.archive.org
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Last updated Jul 29, 2026.

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