YES

CV200 RFS

Wet Processing / Clean 50mm YES CV200 RFS family

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YESCV200 RFS

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Wafer size

50mm

Power

Variable Power Supply from 150 W to 1250 W^[1]

Gas delivery

Up to 7000 angstroms per minute^[1]

What is it?

The YES CV200 RFS Plasma Strip / Descum System is described as a tool for removing thick layers of photoresist or polyimide in short production times. It operates in plasma stripping mode for tough or thick resists and in descum mode for cleaning inorganic substrates. The source lists wafers from 50 mm to 200 mm, variable power from 150 W to 1250 W, real-time wafer temperature measurement and flexible temperature control, and multiple process gas inputs.

What can it run?

Process applications and technology nodes documented for this tool.

Photoresist removal
Polyimide removal
Organics removal
Descum processes

What do the numbers mean?

Power & electrical1

Power supply: Variable Power Supply from 150 W to 1250 W^[1]

Wafer handling2

Wafer size: 50 mm to 200 mm^[1]
Temperature measurement: Real-time wafer temperature measurement^[1]

Gas & chemistry2

Resist removal rate: Up to 7000 angstroms per minute^[1]
Gas inputs: Multiple process gas inputs^[1]

Control & software1

Temperature control: Flexible temperature control^[1]

Configuration & options2

Process: Plasma strip / descum system^[1]
Design: Unique downstream protective design^[1]

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Power supplyVariable Power Supply from 150 W to 1250 W^[1]
Resist removal rateUp to 7000 angstroms per minute^[1]
Gas inputsMultiple process gas inputs^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the CV200 RFS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CV200 RFS are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CV200 RFS are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CV200 RFS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CV200 RFS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CV200 RFS is not on record.
Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources

[1]pnf.uchicago.edu — pnf.uchicago.edupnf.uchicago.edu
[2]Resource Scheduler & Rates | Colorado Shared Instrumentation in Nanofabrication and Characterization (COSINC) | Universi — colorado.educolorado.edu
[3]Photoresist stripper [YES-ash] | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
[4]Yield Engineering Systems, Inc. > Products > Plasma Strip/Descum Systems > CV200RF Series — yieldengineering.com (Mar 29, 2012)web.archive.org