Zeiss
Wafer size
300mm
Performance
Five nanometers[1]
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The following facts about the Ultra-55 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Ultra-55 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Ultra-55 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Ultra-55 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Ultra-55 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Ultra-55 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 26, 2026.
The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.