300mm

The SUSS ACS 300 Gen 2 is a coater/developer system.

The Yes 450 PB 12 Polyimide Bake Oven is a batch process bake oven with capacity for two 25-wafer cassettes and 300mm FOUPs.

The Zeiss Ultra-55 SEM is used as the platform for Zyvex S-100 Nanoprobes.

Asyst ConX300 is a connectivity software solution for semiconductor equipment manufacturers supporting 300mm fabs and 200mm fab upgrades.

The CEE Apogee 300 Bake Plate is a semiconductor wafer bake plate for up to 300mm wafers with recipe-controlled thermal processing and DataStream™ logging.

The Laurell EDC-650-15 is a station-mounted 650-series spin processor that accommodates up to 300 mm wafers and 9" × 9" substrates.

The Laurell EDC-HL-15 B is a 650-series EDC spin processor that accommodates up to 300 mm wafers and 9" × 9" substrates.

Novellus ATHENA software is available for Novellus 300 mm tools that use the Proteus user interface.

Asyst SMIF-300 is a 300 mm SMIF and isolation technology product series for integrated fab solutions.

The YES-58TA is a vacuum bake, HMDS vapor prime, and image reversal system that uses NH3 vapor for image reversal processing.

The Rudolph E25 System is an automated wafer edge top and edge normal inspection system for 300 mm wafers.

The Sonoscan Gen-6 is a C-mode Scanning Acoustic Microscope with scanning capability for JEDEC trays or a 300mm wafer.

The JEOL JBX-9500FS Electron Beam Lithography System can load substrates from 10 mm pieces to 300 mm wafers and write features less than 10 nm in size.

The Laurell H6-15 is a compact HL Series spin coater designed for glove box use and specified to accommodate up to ø 300mm wafers and 9" × 9" substrates.

The Laurell WS-650-15 is a station-mounted spin coater in the 650-series that accommodates up to 300mm wafers and 9" × 9" substrates and reaches a maximum rotational speed of 12,000 RPM.

The EVG Gemini Automated Production Fusion Bonder is a 300mm bonding system with automated handling, recipe programming, and alignment capabilities.