300mm

The CEE Apogee 300 Bake Plate is a semiconductor wafer bake plate for up to 300mm wafers with recipe-controlled thermal processing and DataStream™ logging.

The YES 12-2P-CP is a manual-load high-temperature cure oven for MEMS and semiconductor process applications.

The Rudolph E25 System is an automated wafer edge top and edge normal inspection system for 300 mm wafers.

The SUSS MicroTec AD12 is a manual system for aqueous developing and wafer cleaning, handling wafers up to 300 mm.

The YES PBX4-300 is a fully automated 300mm and 200mm polyimide/BCB/copper anneal and vacuum bake system from Yield Engineering Systems.

The SUSS MicroTec DSC300 Gen2 is an automated full-field scanning projection lithography system for wafers up to 300 mm.

The Laurell EDC-HL-15 B is a 650-series EDC spin processor that accommodates up to 300 mm wafers and 9" × 9" substrates.

The SUSS ACS 300 Gen 2 is a coater/developer system.

The SUSS MicroTec ELP300 Gen2 is an automated excimer laser processing system for substrates up to 300 mm, used for ablation, laser-assisted debonding, and seed layer removal.

The YES PB12 is a PB-HV Series manual-load high vacuum oven, stated to support up to 300 mm wafers and to be designed for MEMS and semiconductor process applications.

The ACS300 Gen3 is an automated coating and developing system for wafers up to 300 mm.

The IVS 380 System performs overlay, CD, and height metrology for 300mm wafers.

The Zeiss Ultra-55 SEM is used as the platform for Zyvex S-100 Nanoprobes.

Asyst SMIF-300 is a 300 mm SMIF and isolation technology product series for integrated fab solutions.

Despatch 300mm-Ofen is a 300mm thermal process tool for clean processing.

The Laurell EDC-650-15 is a station-mounted 650-series spin processor that accommodates up to 300 mm wafers and 9" × 9" substrates.

Novellus ATHENA software is available for Novellus 300 mm tools that use the Proteus user interface.

The YES-58TA is a vacuum bake, HMDS vapor prime, and image reversal system that uses NH3 vapor for image reversal processing.

The PBV-300 is a YES polyimide/BCB vacuum cure oven line for 300mm and 200mm processing. The PBV-300 is placed in the Thermal / Diffusion category.

Cascade Microtech 300 is a 300 mm on-wafer probe system line for advanced test applications.

The Laurell EDC-650-15B is an EDC System spin coater. The Laurell EDC-650-15B supports a maximum substrate size of 300 mm (9" x 9").

The Sonoscan Gen-6 is a C-mode Scanning Acoustic Microscope with scanning capability for JEDEC trays or a 300mm wafer.

The Laurell H6-15 is a compact HL Series spin coater designed for glove box use and specified to accommodate up to ø 300mm wafers and 9" × 9" substrates.

The Laurell WS-650-15 is a station-mounted spin coater in the 650-series that accommodates up to 300mm wafers and 9" × 9" substrates and reaches a maximum rotational speed of 12,000 RPM.

The EVG Gemini Automated Production Fusion Bonder is a 300mm bonding system with automated handling, recipe programming, and alignment capabilities.

The Laurell WS-650-15 B is a 650-series spin coater for resist processing that accommodates up to 300mm wafers and reaches 12,000 RPM.

The SUSS MicroTec AS8 / 12 is a manual coating and developing system for wafers up to 300 mm, with spray coating as its primary process.

The Laurell WS-650-15B is a spin coater in the 650 Series.

The Laurell H6-15 B is a spin coater in the 650-series. The Laurell H6-15 B supports a maximum substrate size of 300mm (9" x 9") and a maximum speed of 12000 rpm.

The Laurell EDC-HL-15 B is an EDC™ System spin coater in the 650-series. The Laurell EDC-HL-15 B accepts a maximum substrate size of 300mm (9" x 9") and reaches 12000 rpm.

ASML Twinscan XT 1950 Hi is a scanner for 12-inch wafers used for 193 nm immersion lithography with 38 nm resolution capacity.

The MA300 Gen2 is an automated mask aligner from SUSS MicroTec for proximity exposure of wafers up to 300 mm.

The ELD300 is a semi-automated excimer laser-assisted debonding system for wafers up to 300 mm.

The Yes 450 PB 12 Polyimide Bake Oven is a batch process bake oven with capacity for two 25-wafer cassettes and 300mm FOUPs.

Asyst ConX300 is a connectivity software solution for semiconductor equipment manufacturers supporting 300mm fabs and 200mm fab upgrades.

The Despatch AST-1100 is an automated photoresist bake tool for 200mm and 300mm semiconductor wafers.

The KLA Surfscan SP 2 is a particle defect inspection system for semiconductor wafers.

The JEOL JBX-9500FS Electron Beam Lithography System can load substrates from 10 mm pieces to 300 mm wafers and write features less than 10 nm in size.

Tokyo Electron NS300Z is a scrubber system for 300mm wafers, featuring process modules with proven reliability and stability, and offering further productivity improvements.