Waferpedia

Tool family

Plasma-Therm Versaline

Plasma-ThermEtch4 entries

Models in this family

  1. Plasma-Therm Versaline is a deposition system. Machines of this class are used to form thin material films on prepared substrates for semiconductor and related precision-process applications.

    Cited variants

    DesignationGenerationVintageChangesSource
    Versaline PECVDIdentified as Plasma-Enhanced Chemical Vapor Deposition.Equipment inventory listing[1]
    Versaline CVDListed as a CVD system with 3 Chamber Deposition, PCVD Versaline Chambers (x2), HDP-CVD Versaline Chamber, PM Modules (x3), Brooks MX 600, HDD, Versaline Software, and Manuals.Equipment inventory listing[2]
  2. The Plasma-Therm Versaline LACVD is an etch system for 6-inch wafers.

  3. The Plasma-Therm Versaline VCX 600 ICP is a 6-inch inductively coupled plasma etch system.

All entries

  1. VersalinePlasma-Therm

    General referencePlasma-Therm Versaline is a deposition system. Machines of this class are used to form thin material films on prepared substrates for semiconductor and related precision-process applications.

    CategoryDeposition
    9 specs
  2. Versaline LACVDPlasma-Therm

    The Plasma-Therm Versaline LACVD is an etch system for 6-inch wafers.

    CategoryEtch
    20 specs
  3. Versaline VCX 600 ICPPlasma-Therm

    The Plasma-Therm Versaline VCX 600 ICP is a 6-inch inductively coupled plasma etch system.

    CategoryEtch
    7 specs
  4. Versaline VLN ICPPlasma-Therm
    CategoryEtchWaferBrooks TM (Transfer Module) with four Wafer Manual Load Lock
    16 specs

Sources

Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing