Accretech
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The Accretech / TSK AP 3000 e is a tri-temp prober used for semiconductor testing. The AP 3000 e is compatible with HP93K 12-inch POGO type testers. The AP 3000 e is also offered in a DD Tri-Temp configuration.[1][2]
A wafer prober is semiconductor test equipment that brings a processed wafer into controlled contact with a probe card so electrical measurements can be performed before singulation and packaging. Wafer probers serve the wafer test stage by positioning, aligning, and thermally conditioning wafers for connection to external test instrumentation.
The AP3000/AP3000e is designed for high precision, high throughput in index move, wafer handling, and wafer alignment, with low vibration and low noise. The AP3000/AP3000e inherits functions and operability from previous models and maintains compatibility of recipe and map data. The AP3000/AP3000e includes standard anti-virus and anti-malware software. The AP3000/AP3000e offers options including needle cleaning, fan filter unit, HF jig or manipulator, tester interface, dual loader or AMHS automation, head stage tilt, ambient or hot or low-temperature or low-noise chucks, auto probe card exchange, cassette ID reading, wafer ID reading, network interfaces, probe card auto setup, and probe card PGV. The AP3000/AP3000e supports PLP testing for up to 300 mm square.[6]
The AP3000 / AP3000e operates at overall precision of +/- 0.8 um and +/- 1.5 um under Accretech specified conditions. The AP3000 / AP3000e can process 300 mm or 200 mm bare wafers. The AP3000 / AP3000e is available in single or dual loader configuration with AMHS automation. The AP3000 / AP3000e provides chuck choices for ambient operation, hot temperature up to 200C, low temperature down to -55C, and low-noise use. The AP3000 / AP3000e is compatible with major semiconductor testers and offers GP-IB interface and prober network options including Veganet, Light-Veganet, Vega-Planet, and GEM.[5]
Wafer probing sits after wafer fabrication and before dicing, assembly, and final package test. A wafer prober is used after front-end and back-end wafer processing has produced testable devices and before downstream steps separate the die and place them into packages.
Wafer probers are used for wafer-level electrical test of integrated devices before singulation. Typical uses include device screening, parametric measurement, functional verification, temperature-conditioned test, and die map generation for later manufacturing steps.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| DD Tri-Temp | — | 2022 | Includes DD (unknown meaning) and tri-temp capability | Equipment inventory listing[2] |
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The AP3000 / AP3000e can process 300 mm or 200 mm bare wafers.[5]
The following facts about the AP 3000 e are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AP 3000 e are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the AP 3000 e are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AP 3000 e are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AP 3000 e is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the AP 3000 e are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Last updated Oct 20, 2026.
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