Angstrom Engineering

EvoVac

Deposition 6 in Angstrom Engineering EvoVac family

Research Quality: 40% complete

LinkedIn X Email

EvoVac — pnf.uchicago.edu — Fig. 01EvoVacpnf.uchicago.edu^[1]

Wafer size

6 in

Optics

Electron beam evaporation^[1]

What is it?

The Angstrom Engineering EvoVac Electron Beam Evaporator is a load-locked physical vapor deposition tool used to evaporate high melting point materials such as refractory metals and ceramics using an electron beam. The source describes multiple deposition capabilities, including principal electron-beam evaporation, resistive thermal evaporation, ion-assisted deposition, and sputter deposition.

What can it run?

Process applications and technology nodes documented for this tool.

Electronic and optical semiconductor films
Wear resistant and thermal barrier coatings
Hard coatings for tools

What do the numbers mean?

Wafer handling3

Wafer size: Wafers to 6 in^[1]
Source-to-substrate distance: Long source to substrate distances^[1]
In-situ functions: In-situ substrate pre-cleaning, low energy ion beam etching, and surface modification^[1]

Optics & imaging1

Primary process: Electron beam evaporation^[1]

Control & software2

Sweep controller: Programmable 2-axis sweep controller^[1]
Deposition control: Advanced multi-layer deposition control for precise layer monitoring^[1]

Configuration & options5

Tool type: Load-locked PVD tool^[1]
Additional deposition modes: Resistive thermal evaporation, ion assisted deposition, and sputter deposition^[1]
E-beam source: 6 pocket E-beam source^[1]
Crucible volume: 15 cc crucibles^[1]
Ion source: Kaufman gridless ion source^[1]

Interested in this tool?

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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the EvoVac are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EvoVac are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the EvoVac are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the EvoVac are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EvoVac are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EvoVac is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources

[1]pnf.uchicago.edu — pnf.uchicago.edupnf.uchicago.edu
[2]Resource Scheduler & Rates | Colorado Shared Instrumentation in Nanofabrication and Characterization (COSINC) | Universi — colorado.educolorado.edu