Applied Materials

Wafer size
150mm
Gas delivery
TEOS/O2[8]
Both chambers can process wafers up to 8 inches in diameter and deposit films multiple microns thick.[8]
The tool is used for dielectric PECVD, silicon dioxide deposition with TEOS/O2 chemistry, and silicon nitride deposition with SiH4/NH3 capability.[8]
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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It can deposit silicon dioxide and silicon nitrides.[8]
Both chambers can process wafers up to 8 inches.[8]
The nominal operating temperature is about 400 C.[8]
It has two dedicated chambers for dielectric PECVD.[8]
The following facts about the P5000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P5000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the P5000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the P5000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the P5000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the P5000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 25, 2026.
The Kurt Lesker ALD-150LX is a plasma-enhanced atomic layer deposition system with a load-locked process chamber and in situ ellipsometer, configured for up to 150 mm wafers.
The Kurt Lesker ALD-150LX is a plasma-enhanced atomic layer deposition system used for thin-film growth with atomic-scale control.