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Kurt Lesker

ALD-150LX

Deposition150mmKurt Lesker ALD-150LX family
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The ALD-150LX is a plasma-enhanced atomic layer deposition system. The ALD-150LX supports substrates up to full 150 mm wafers. The ALD-150LX includes an in situ ellipsometer system for monitoring film growth.[1][2]

ALD-150LX — smif.pratt.duke.edu
Fig. 01ALD-150LXsmif.pratt.duke.edu[1]

Wafer size

150mm

Optics

Film Sense FS-1 Multi-Wavelength[1]

What it is

General reference — not yet source-verified

Atomic layer deposition systems deposit thin films by exposing a substrate surface to reactants in repeated, self-limiting steps. Plasma-enhanced atomic layer deposition systems add plasma activation to broaden film chemistries and reduce reliance on substrate heating alone. Deposition tools of this class are used when conformal coverage and close thickness control are important.

How it works

The Kurt Lesker ALD-150LX supports thermal-only and plasma-enhanced process modes. The Kurt Lesker ALD-150LX has ellipsometry ports as a standard chamber feature. The Kurt Lesker ALD-150LX has four standard independently heated precursor inlets to the chamber. The Kurt Lesker ALD-150LX supports dynamic and static exposure for high aspect ratio work and Variable Residence Mode. The Kurt Lesker ALD-150LX supports up to fourteen precursor types and up to six plasma process gases.[4]

Where it fits in the process flow

The Kurt Lesker ALD-150LX accepts substrates up to full 150 mm wafers. The Kurt Lesker ALD-150LX also accepts small samples clipped to a wafer carrier. The Kurt Lesker ALD-150LX requires substrates with no exposed organics such as polymers and no exposed materials with high outgassing properties.[1]

What can it run?

Process applications and technology nodes documented for this tool.

  • Plasma-enhanced atomic layer deposition
  • Conformal fabrication of thin films with atomic-scale control
  • Growth of requested oxide, nitride, and oxide-related films

What do the numbers mean?

Wafer handling4

Substrate specification
No exposed organics such as polymers[1]
Accurate?
Substrate specification
No exposed materials with high outgassing properties[1]
Accurate?
Small samples
Able to be clipped to wafer carrier[1]
Accurate?
Wafer size
150mm[3]
Accurate?

Optics & imaging3

In situ ellipsometer
Film Sense FS-1 Multi-Wavelength[1]
Accurate?
Maximum film thickness stated
up to 20 nm[1]
Accurate?
In situ ellipsometry
Film Sense FS-1 Multi-Wavelength[1]
Accurate?

Configuration & options8

OEM
Kurt Lesker[2]
Accurate?
Model
ALD-150LX[2]
Accurate?
Load-locked
Yes[1]
Accurate?
Available film growth by request
Al2O3, HfO2, ZrO2, HfZrO2, TiN, Ga2O3[1]
Accurate?
Category
Deposition[3]
Accurate?
Process type
Plasma-enhanced atomic layer deposition (PE-ALD)[2]
Accurate?
Load-lock
Load-locked system[1]
Accurate?
Supported films by request
Al2O3, HfO2, ZrO2, HfZrO2, TiN, Ga2O3[1]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

Is the Kurt Lesker ALD-150LX configured for plasma-enhanced ALD?

The Kurt Lesker ALD-150LX is configured as a plasma-enhanced atomic layer deposition system.[2][1]

Does the Kurt Lesker ALD-150LX use a load lock?

The Kurt Lesker ALD-150LX is a load-locked system that keeps the processing chamber isolated from the sample loading chamber.[1]

What substrate size does the Kurt Lesker ALD-150LX support?

The Kurt Lesker ALD-150LX supports substrates up to full 150 mm wafers. Small samples can also be clipped to a wafer carrier.[1][4]

Not publicly documented

The following facts about the ALD-150LX are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ALD-150LX are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the ALD-150LX are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the ALD-150LX are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the ALD-150LX are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the ALD-150LX is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]smif.pratt.duke.edu — smif.pratt.duke.edusmif.pratt.duke.edu
  2. [2]smif.pratt.duke.edu — smif.pratt.duke.edusmif.pratt.duke.edu
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Kurt J. Lesker Company | ALD-150LX Thin Film Deposition System | Enabling Technology for a Better World — lesker.comlesker.com
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Last updated Oct 17, 2026.

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