ASML
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The ASML PAS 5500/400 is an i-line stepper designed for 8-inch wafers with a resolution of 280nm.[1]

In a step-and-repeat system, a reduction lens projects the image of a reticle (photomask) onto a small exposure field on the wafer. After each exposure, the wafer stage moves the next field into position under the lens, repeating the process until the entire wafer is patterned. The i-line light source in this class of stepper is produced by filtering a mercury arc lamp to isolate the i-line spectral band.
A stepper of this class is positioned in the photolithography module of a semiconductor fabrication line, after photomask creation and prior to plasma or wet etching, ion implantation, and material deposition. The patterned photoresist formed by the stepper acts as a mask for subsequent processing steps.
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The ASML PAS 5500/400 is a stepper, specifically an i-line stepper.[1]
The following facts about the PAS 5500 400 i-Line are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PAS 5500 400 i-Line are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the PAS 5500 400 i-Line are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the PAS 5500 400 i-Line are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the PAS 5500 400 i-Line are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the PAS 5500 400 i-Line is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 3, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.