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ASML

PAS5500/80

Lithography500nmASML PAS5500/80 family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The ASML PAS5500/80 is an ASML stepper for lithography exposure. The ASML PAS5500/80 exposes one die at a time with i-line or 365 nm UV light. The ASML PAS5500/80 has a resolution down to 500 nm.[1][2][3]

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Fig. — Manufacturer logo, not a photo of this toolWikimedia Commons (see file page for license)

Node / era

500nm

Performance

<±2%[2]

Optics

down to 500 nm[1]

What it is

The ASML PAS5500/80 is a lithography stepper. The ASML PAS5500/80 provides automatic alignment and exposure of photoresist films. The ASML PAS5500/80 exposes with resolution down to 500 nm.[1][2]

How it works

The ASML PAS5500/80 exposes one die at a time with i-line or 365 nm UV light before stepping to the next die. The ASML PAS5500/80 forms the exposed image by transmitting UV light through a patterned chrome layer on a quartz reticle or photomask. The ASML PAS5500/80 uses projection optics with 5X image scale reduction, so the image on the wafer is smaller than the pattern on the reticle.[2]

Where it fits in the process flow

General reference — not yet source-verified

Lithography steppers operate in the patterning portion of wafer fabrication after resist coating and soft bake. Lithography steppers are used before resist development and before pattern transfer steps such as etch, implantation, or lift-off. Lithography steppers are part of the repeated cycle by which successive patterned layers are aligned and exposed across a wafer.

Applications

The ASML PAS5500/80 accepts standard substrates of 4 inch wafers and is technically configurable for 6 inch and 8 inch wafers. The ASML PAS5500/80 accepts substrate thickness from 300 µm to 1000 µm. The ASML PAS5500/80 offers backside alignment through 3DAlign. The ASML PAS5500/80 supports multi-step imaging with focus offset up to ±200 µm. The ASML PAS5500/80 can use carrier wafers when wafers have through-etched features or deep backside cavities.[2]

  • Exposure

What do the numbers mean?

Wafer handling5

Standard substrates
4 inch (100 mm) wafers[2]
Accurate?
Technically configurable wafer sizes
6 inch (150 mm) and 8 inch (200 mm) wafers[2]
Accurate?
Substrate thickness range
300 µm – 1000 µm[2]
Accurate?
Throughput
> 95 wafers/hour on 100 mm diameter wafers[2]
Accurate?
Batch streaming
Load and unload cassettes with 25 wafers at a time[2]
Accurate?

Gas & chemistry1

Function
Automatic alignment and exposure of photoresist films[2]
Accurate?

Optics & imaging9

Resolution
down to 500 nm[1]
Accurate?
Wavelength
365 nm[2]
Accurate?
Resolution
0.5 µm[2]
Accurate?
Stage repeatability
8 nm[2]
Accurate?
Overlay
45 nm[2]
Accurate?
Minimum exposure dose
40 mJ/cm2[2]
Accurate?
Reticle material
Ultra-low thermal expansion quartz[2]
Accurate?
Nominal reticle size
6 x 6 inch (152.40 x 152.40 mm)[2]
Accurate?
Default reticle thickness
0.120 inch (3.05 mm)[2]
Accurate?

Performance1

Uniformity
<±2%[2]
Accurate?

Configuration & options2

Equipment type
ASML Stepper[1]2 sources
Accurate?
Intensity
400 mW/cm2[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • FunctionAutomatic alignment and exposure of photoresist films[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What kind of lithography tool is the ASML PAS5500/80?

The ASML PAS5500/80 is a stepper for automatic alignment and exposure of photoresist films.[2]

What exposure wavelength does the ASML PAS5500/80 use?

The ASML PAS5500/80 uses i-line or 365 nm UV light.[2]

What wafer sizes can the ASML PAS5500/80 handle?

The ASML PAS5500/80 is set up for standard 4 inch 100 mm wafers and is technically configurable for 6 inch 150 mm and 8 inch 200 mm wafers.[2]

Does the ASML PAS5500/80 support backside alignment?

The ASML PAS5500/80 has backside alignment available through 3DAlign.[2]

Not publicly documented

The following facts about the PAS5500/80 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PAS5500/80 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the PAS5500/80 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the PAS5500/80 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the PAS5500/80 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • No publicly documented compatible parts, consumables, or accessories for the PAS5500/80 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]tudelft.nl — tudelft.nltudelft.nl
  2. [2]tudelft.nl — tudelft.nltudelft.nl
  3. [3]PAS5500/80 — ASML | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 17, 2026.

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