Anelva ILD 4100 SR Dry

The Canon Anelva ILD 4100 SR Dry belongs to the etch equipment class. Such systems are used after a pattern has been defined in a masking layer or photoresist, transferring that pattern into an underlying film by removing exposed material while leaving protected areas in place.

Dry etch tools generally operate by creating a low-pressure plasma from process gases inside a vacuum chamber. Reactive species formed in the plasma interact with the wafer surface, breaking chemical bonds and forming volatile byproducts that can be pumped away. Depending on the process, removal can be predominantly chemical, predominantly physical through ion bombardment, or a controlled combination of both.

Such systems typically use wafer clamping, controlled gas delivery, pressure regulation, radio-frequency power coupling, and exhaust handling to maintain stable plasma conditions. Etch behavior is tuned through the chemistry and energy balance to achieve the desired anisotropy, selectivity to underlying or masking films, residue control, and end-of-etch behavior. In production use, this class of machine is commonly paired with chamber seasoning, wafer handling, and post-etch clean steps to support repeatable pattern transfer.