Cascade Microtech
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A probe positioner is part of wafer probing equipment used to place electrical probes onto contact pads or other test points on a device under test. A probe station of this class supports electrical access to fabricated structures before packaging and can also support work on bare die, wafers, and small samples.
Probe positioners of this class provide controlled mechanical motion so an operator can bring a probe tip into contact with a target structure under visual observation on a probe station. Kelvin probing in this class uses separate force and sense connections at the contact point so measurement lead resistance has less effect on low resistance electrical measurements.
Probe stations and probe positioners are used after structures have been fabricated and made electrically accessible, when a wafer or die is ready for electrical characterization. Equipment of this class sits in characterization, failure analysis, and device development workflows rather than in patterning, deposition, or etch steps.
Probe positioners of this class are used to contact pads, lines, and device terminals for current and voltage measurements on experimental and production related samples. Equipment of this class is commonly applied to transistor, resistor, interconnect, sensor, and passive structure evaluation where direct electrical access on an unpackaged sample is needed.
Control-system eraWindows 10[1]
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The Cascade Microtech 208 is a test and probe instrument that serves as a probe positioner used on a probe station for semiconductor electrical testing.[2]
The following facts about the 208 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 208 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 208 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
No publicly documented failure modes or field errata for the 208 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 208 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 208 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 20, 2026.
The Tenney TPS JR-A-F4T is a junior compact temperature test chamber with a 1.2 cubic foot chamber size and a temperature range of -68°C to +180°C.
The Rorze 03 RR 8120-001-001 is a wafer exchanger for 8-inch wafers.