Disco
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The Disco DCS 1460 is an automatic cleaning system designed for 300 mm wafers. The system is used to clean workpieces that have been cut on a dicing saw. The DCS 1460 supports wafers from 3 to 12 inches mounted on tape and frames. As an option, the system also supports square workpieces up to 310 x 310 mm.[2]
The DCS 1460 features a 4-inch LCD touch panel for simple operation. Cleaning sequences are configurable, allowing the user to set sweep speed and cleaning locations. The table rotates at speeds from 100 to 3000 min^-1. Cleaning time can be set from 0 to 999 seconds. The system can be equipped with a high-pressure cleaning nozzle and an optional atomizing cleaning nozzle. The atomizing nozzle generates a mist by mixing fluid droplets with air, producing strong cleaning with minimal damage.[2]
Dicing saws cut wafers into individual die, leaving debris and coolant residue on the surfaces. Cleaning systems are placed immediately after the dicing step to remove these contaminants before subsequent processing such as die attach or inspection.
The DCS 1460 supports a diverse range of workpieces, from round wafers to square substrates. The optional atomizing cleaning nozzle is effective for cleaning sensitive structures with minimal damage, making it suitable for advanced device cleaning.[2]
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The following facts about the DCS 1460 Wafer Cleaner Spin are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DCS 1460 Wafer Cleaner Spin are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DCS 1460 Wafer Cleaner Spin are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DCS 1460 Wafer Cleaner Spin are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DCS 1460 Wafer Cleaner Spin are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DCS 1460 Wafer Cleaner Spin is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 20, 2026.
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