Eagle
ETS 200 T
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedThe ETS 200 T operates as a digital or mixed-signal tester that applies test patterns to a device under test (DUT) through pin electronics. The tester measures the DUT's responses and compares them to expected results to determine pass or fail. When used with a prober, the system steps the wafer so that each die is sequentially contacted by probe needles connected to the tester's channels.
Where it fits in the process flow
General reference — not yet source-verifiedThe ETS 200 T is used in the wafer sort (probe) stage of semiconductor manufacturing, after wafer fabrication and before dicing and packaging. The ETS 200 T tests each die on the wafer to identify functional devices before they proceed to assembly. The ETS 200 T can also be used in final test for packaged parts, depending on the test configuration.
Applications
General reference — not yet source-verifiedThe ETS 200 T is applied to testing a range of semiconductor devices including logic circuits, memory arrays, and mixed-signal components. The ETS 200 T supports applications in consumer electronics, automotive electronics, and industrial control systems where high-volume wafer-level testing is required.
What do the numbers mean?
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Accretech UF 300 A Automatic Wafer— Same function class: Test & Probe, UnknownCompare in depthsource[1]
- Teradyne J 750— Same function class: Test & Probe, UnknownCompare in depthsource[1]
- Teradyne ETS 364— Same function class: Test & Probe, UnknownCompare in depthsource[1]
- Teradyne Ultra Flex SC— Same function class: Test & Probe, UnknownCompare in depthsource[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the ETS 200 T are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the ETS 200 T are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ETS 200 T are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ETS 200 T are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ETS 200 T are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ETS 200 T are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]ETS-200T / ETS-200T-FT - Teradyne — eagletest.com (Aug 14, 2015)web.archive.org
Last updated Aug 18, 2026.
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General referenceTeradyne ETS 364 is a test and probe system used to electrically evaluate semiconductor devices. Machines of this class combine probe contact, signal handling, and automated test control for device characterization and screening.
General referenceTeradyne J 750 is a semiconductor test and probe system used for electrical evaluation of devices during manufacturing. It belongs to the class of automated test equipment that supports wafer or device-level screening before final assembly.
The Accretech / TSK UF 300 A is an automatic wafer prober for 8-inch wafers.
